Technology, Process and Cost
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies
By Yole SystemPlus —
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers
Overview/Introduction
Company Profile and Supply Chain
iPhone X – Teardown Goertek/Knowles/AAC Technologies
Physical Analysis
- Package
- Package view and dimensions
- Package opening
- Package cross-section
- ASIC Die
- View, dimensions and marking
- Dicing
- Delayering and process
- Cross-section
- MEMS Die
- View, dimensions and marking
- Dicing
- Membrane and backplate
- Anti-stiction bumps
- Cavity
- Cross-section
Manufacturing Process Flow
- ASIC Front-end Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
Physical Analysis Comparison
Goertek/Knowles/AAC Technologies – Cost Analysis
- Cost Analysis Overview
- Yield Hypotheses
- ASIC Front-end Cost
- ASIC Wafer and Die Cost
- MEMS Front-end Cost
- MEMS Wafer and Die Cost
- Back-end: Packaging Cost
- Microphone Component Cost
Goertek/Knowles/AAC Technologies – Estimated Sales Price
Manufacturing Cost Comparison
For microphone integration in the iPhone X, Apple has chosen the market’s top three microphone suppliers: Goertek, Knowles, and AAC Technologies.
The Apple iPhone X has four MEMS microphones: a front-facing top microphone, two front-facing bottom microphones, and a rear-facing top microphone. This layout is similar to previous iPhones, but the front-facing bottom-right microphone is now integrated in the speaker module. All four microphones share the same Apple-specific package dimensions, but with a different internal structure (number of substrate metal layers, embedded capacitance, ASIC, etc.).
In the iPhone X, we’ve observed changes to the microphones provided by Apple’s three suppliers:
Goertek, which still relies on Infineon for die manufacturing, integrates Infineon’s technology with a double backplate, delivering a differential MEMS microphone. For the ASIC, Goertek has considerably reduced the die area by around 40% compared to the previous die.
Knowles uses the same technologies as before, but one part has a new MEMS design and another part has an existing MEMS design.
AAC uses the same MEMS microphone die as Goertek, but with a different ASIC.
Infineon is a big winner. By providing ASIC and MEMS dies to all of Goertek’s and AAC Technologies’ products, it now possesses a large share of the MEMS microphone market.
REVERSE COSTING WITH
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated sales price
- Comparison with previous microphones found in the iPhone 7, by supplier
- Comparison between each supplier (Knowles vs. Goertek vs. AAC)