Technology, Process and Cost Comparison
Automotive CIS Comparison 2024
By Yole SystemPlus —
This report is scheduled for Q4 2024
SPR24821
THIS TABLE OF CONTENTS IS FROM THE PREVIOUS EDITION - IT MIGHT BE UPDATED.
Overview / Methodology
- Executive Summary
- Reverse Costing Methodology
- Glossary
Companies, Market & Supply Chain
- Onsemi, OmniVision, Infineon
- Players & Market Context
- Automotive Track Data
- Supply Chain
Physical Comparison
- Overview
- Key Results
- Exhaustive Results
- Package
- BGA
- a-CSP
- Optical Filters
- Color Filters & Microlenses
- Pixel Transistors
- Stacking
Manufacturing Processes
- CMOS Image Sensor Structure
- onsemi CMOS Image Sensor Manufacturing Processes
- Supply Chain and Process Overviews
- Fabs
- Front-End
- Melexis CMOS Image Sensor Manufacturing Processes
- Supply Chain and Process Overviews
- Fabs
- Front-End
- Infineon CMOS Image Sensor Manufacturing Processes
- Supply Chain and Process Overviews
- Fabs
- Front-End
- OmniVision CMOS Image Sensor Manufacturing Processes
- Supply Chain and Process Overviews
- Fabs
- Front-End
Cost Comparison & Breakdown
- Overview
- Sensor Die Front-End Costs
- Advanced Chip Scale Package Costs
- Die Costs
- Singulated Package Costs
- Component Costs & Prices
Detailed Physical Analysis
- onsemi AR0135AT
- Package
- Sensor Die
- Melexis MLX75027
- Package
- Sensor Die
- Infineon IRS1125A
- Package
- Sensor Die
- OmniVision OX05B
- Package
- Sensor Die
Feedback
Related Products
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