Technology, Process and Cost Comparison
Automotive Power Module Comparison 2022
By Yole SystemPlus —
Technology and cost comparison of seven automotive power modules from: Hitachi, StarPower, Vitesco Technologies, STMicroelectronics, DENSO, and Wolfspeed.
The new environmental regulations to reduce average CO2 emissions and automotive trends play in favor of greater vehicle electrification and faster deployment of electric vehicles/hybrid electric vehicles (EV/HEVs).
Power modules are a key element for this transition. According to Yole Intelligence, the power module market for xEV represented a market value of $807 million in 2020 and will reach $3.59 billion by 2026.
Innovations in power module design are continuously being developed for enhanced performance. We can find them in all power module structures, from the baseplate and substrate assembly down to the die attach and through the electrical connection.
In this dynamic context of the power modules packaging market, Yole SystemPlus provides a deep comparative review of seven automotive power modules (including three SiC power modules), with a focus on packaging level. The modules are from Hitachi, StarPower, Vitesco Technologies, STMicroelectronics, DENSO, and Wolfspeed.
This report provides, in its introductory section, exhaustive graphs concerning all the trends and design solutions observed in all analyzed modules by Yole SystemPlus in its previous reports. For the seven modules analyzed in this report, we highlight differences in module design and technology parameters and their impact on production cost.
Also provided are optical images for the module’s package view, package opening, and cross-section, as well as SEM cross-section images for some of the analyzed modules.
Cost simulations are performed for all of the modules’ parts (die and module level). Process and cost are only detailed at the module level – substrate: DBC/AMB/plate assembly process and module assembly process. The dies’ process is not detailed; just the final die cost is imported in the module’s BOM cost.
Finally, this report provides exhaustive physical, technological, and manufacturing cost comparisons of the analyzed modules.
Overview / Introduction
- Executive summary
- Reverse costing methodology
Technology & Market
- Power Module Packaging Market Development
- Analyzed Automotive Modules Supply Chain with Integration In Cars
- Power Module Parts Solutions
- Trends of Module Electrical Interconnections
- Trends of Die Attach vs. Die Type vs. Substrate/Plate Type
- Vitesco Technologies
7 modules from:
- Hitachi (Si)
- StarPower (Si)
- Vitesco Technologies (Si)
- STMicroelectronics (SiC)
- DENSO (SiC)
- DENSO (Si)
- Wolfspeed (SiC)
- Symmary of the module’s localization in Inverter/Converter
- Package Dimensions
- Package Opening
- Package Cross-section
Technology and Physical Comparison
- Substrates/Plates vs Transistor type
Manufacturing Process Flow
- Analyzed Automotive Modules Supply Chain (including Wafer Fab Location)
- Description of the Assembly Unit for each module
- Description of the Process Flow for each module
- Yields Explanation & Hypotheses
- For each of the 7 Modules:
- Substrate BOM Cost (includes Die Cost imported in BOM)
- Substrate assembly cost
- Module BOM Cost
- Module assembly Cost
- Final Test Cost
- Module Total Cost
- Comparisons include module total cost breakdown, Cost per : Area, per Volume, and per module mass.
- Inverter Cost per kilo-Watt ($/kW)
System Plus Consulting Services
- Module technology and design trends (interconnections, die attach, DBC/AMB/plate, baseplate…)
- Optical photos of module opening and cross-section
- SEM cross-sections for some modules
- Assembly process flow
- Supply chain evaluation
- Module cost analysis (die cost is not detailed)
- Part of the analyzed power modules are from torn-down inverters of five xEVs.
- Exhaustive comparisons of power module technology choices.
- Three silicon carbide-based power modules are analyzed.
Available on our Yole Group All-Inclusive Automotive Package