Technology, Process and Cost Comparison
Automotive Telematic Chipsets Comparison 2022
By Yole SystemPlus —
Detailed analysis of the technologies and cost of the main telematics systems and their chipsets, including cellular modules from Continental, LG, Quectel, and others.
SPR22669
- Avago/Broadcom
- Continental
- Cypress/Infineon
- Intel
- Gemalto
- LG Innotek
- Kyocera
- Marvell/NXP
- MediaTek
- Murata
- Qorvo
- Qualcomm
- Quectel
- Skyworks
- Tayo Yuden
- Tellit (Titan O)
- U-Blox
- Wisol
- Wistron Neweb Corporation
Overview / Introduction
Executive Summary
- Key Take Away
- Summary: Telematic Systems and Sub-System
- Reverse Costing Methodology
Company Profile
- WNC, LG Innotek, Murata, Continental, Quectel
Thales, Telit, U-Blox
Physical Comparison
- Module Overview
- Module Size and Complexity
- Module Device Technology
- Telematic Module BoM Cost
Physical Analysis
- Summary of SoC Physical Analysis
- Wifi/BT SoC
- Cypress/Infineon
- Package Views & Dimensions
- Package OpeningDie Views & Dimensions
- Die Overview, Delayering and Main Block IDs
- Die Process & Cross-Section
- Die Process Characteristics
- Marvell/Infineon
- Physical Comparison of Wifi/BT SoC
- Cellular SoC
- Mediatek
- Qualcomm
- Physical Evolution of Qualcomm’s Modem and RxTx for Automotive
- Intel
- Physical Comparison of Cellular SoC
- GNSS SoC
- U-Blox
- Cypress/Infineon
- Wifi/BT SoC
Cost Analysis
- Cost Analysis of Connectivity SoC
- Cypress/Infineon
- Supply Chain & Fabrication Unit
- Wafer, Die and Component Cost
- Marvel/NXPCost Analysis of Cellular SoC
- MediaTek
- Qualcomm
- Intel
- Cost Analysis of GNSS SoC
- U-Blox
- Cypress/Infineon
Cost Comparison
- Wafer Cost and Price
Customer Feedback
Related Products
About Yole Group
In order to keep pace with innovations in autonomous driving vehicles and communications, telematics systems for automotive applications must evolve and offer state-of-the-art devices that support the harsh environment of the car. Up to now, LTE communication modules have been integrated in vehicles to offer in-car communication and vehicle-to-infrastructure connection. With the rising of 5G in consumer applications, today’s cars need to be updated with a new module that offers this latest technology. To track how this technology is evolving and see what’s on the horizon, now is the perfect time to investigate every player and compare telematics Tier-1s, module suppliers, and current technologies. To this end, the first 5G cellular module from Wistron Neweb Corporation (with MediaTek chipset) is included in our comparison.
This comparative technology study provides insights regarding technology data for radiofrequency (RF) chipsets in telematic/GNSS/Wi-Fi systems. Also included is a study of 17 telematics systems from several Tier-1s such as WNC, Murata, Continental, LG Innotek, Kyocera, Telit, Quectel, Thales, and U-Blox. This report highlights several technical choices in the different applications. For example, in the Wi-Fi and cellular segments, LG Innotek is the only Tier-1 that can supply a module in both segments. Yet, Quectel, Telit, and U-Blox are the only companies involved in Tesla’s supply chain for in-car telematics modules. Also, in the Tesla hardware the change of cellular module doesn’t imply continuity with the same chipset provider. Indeed, with Quectel the chipset comes from Qualcomm – but with Telit, it comes from Intel. Thus, a comparison between these chipsets is made in this report to evaluate the impact in terms of technical choice in the full structure of the module and the cost. Finally, with the improvement of the technology and the addition of 5G cellular communication, the structure of the module is about to change. Indeed, we have observed the uprising of the integrated module and fully-integrated diversity path, along with an increase of the total cost and the main SoC in the module.
This report includes a description of each component, as well as statistical analyses for most telematics systems – focusing on the RF board. Moreover, a complete SoC die analysis and processes are provided, along with a complete cost analysis and a selling price estimation of the chipset. Finally, we compare the costs of the main systems in order to explain the OEMs’ choices and supplier preferences. Please note that the main board analyses, along with full BOMs and system cost, are not covered in this report.
KEY FEATURES
- Complete bills-of-materials for the RF chipsets
- Comparison between suppliers
- Comparison between Tier-1s
- Cost comparison between the main telematics systems
- Cost comparison between the main chipsets
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
WHAT'S NEW
With the evolution of the 5G network on the consumer side, telematics support also needs to evolve in the automotive landscape to follow the path. To this end, we have selected several devices from different carmakers to provide a technical and cost evolution of the TCU through time: from Wifi/BT/GNSS/2G to 5G solutions.