Technology, Process and Cost
Bestechnic Ultra-low power bluetooth wearable SoC (BES2700BP)
By Yole SystemPlus —
Ultra-Low Power Bluetooth wearable platform
SPR23751
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Summary of the physical analysis
- Watch S1 Pro Teardown
- Module overview and opening
- Package Assembly
- Views & Dimensions
- Opening
- Cross-Section
- IC Die #1/ #2/ #3
- Views & Dimensions
- Delayering/Process
- Cross-Section
- Characteristics
- IC Die #4
- Views & Dimensions
- Delayering/Process
- Characteristics
- IC Die #5
- Views & Dimensions
- Cross-section
- Characteristics
Manufacturing Process Flow
- Global Overview
- Die #1 - Front-End Process
- Die #1 - IC Wafer Fabrication Unit
- Die #2 - Front-End Process
- Die #2 - IC Wafer Fabrication Unit
- Die #3 - Front-End Process
- Die #3 - IC Wafer Fabrication Unit
- IC Back-End 0
- Final Test & Assembly Unit
- Summary
Cost Analysis
- Cost Summary
- Main steps of economic analysis
- Yields Explanation & Hypotheses
- Die #1 - Front-End Cost
- Die #1 - Wafer & Die Cost
- Die #2 - Front-End Cost
- Die #2 - Wafer & Die Cost
- Die #3 - Front-End Cost
- Die #3 - Wafer & Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the BES2700BP from BES Technology.
This is an ultra-low power Bluetooth wearable platform, also an ultra-low power Bluetooth audio platform for TWS, hybrid ANC and AI voice application.
The BES2700BP was find in the watch S1 Pro from Xiaomi. The dimensions of the package are 7.3 mm x 7.2 mm x 0.76 mm and the type of the package is a BGA SoC 255-pin.
BESTechnic, Puya Semiconductor, TSMC, SMIC, Gigadevice, AP Memory.
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Selling Price Estimation
Product objectives
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the BES2700BP from BES Technology.