Technology, Process and Cost
Bosch IMU in iPhone 14 Pro
By Yole SystemPlus —
Detailed technology and cost analysis of the latest BOSCH IMU found in the iPhone 14 Pro
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Comparison between IMU in the iPhone 13 Pro Max and iPhone 14 Pro
What’s new
- Description of the latest innovation in the Micro-ElectroMechanical System (MEMS) inertial sensor industry: the Laser ReSeal process invented and implemented by BOSCH in the Inertial Measurement Unit (IMU) found in the iPhone 14.
- Analysis of the packages, the MEMS accelerometer and MEMS gyroscope dies.
- Comparison of Application Specific Integrated Circuits (ASICs) between the IMU in the iPhone 13 Pro Max and the iPhone 14 Pro.
- Cost comparison between MEMS gyroscope front-end costs for the IMUs integrated in the iPhone 13 Pro Max and the iPhone 14 Pro.
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Bosch Financials
- BOSCH IMU Characteristics
- BOSCH Supply Chain
Physical Analysis
- Summary of the Physical Analysis
- Package Analysis
- Package Views & Dimensions
- Package Marking
- Package Opening
- Package Cross-Section
- Focus on Accelerometer die
- Focus on Gyroscope die
- Package process summary
- Bosch ASIC
- ASIC Die View & Dimensions
- ASIC Die Delayering
- ASIC Die Cross-Section
- ASIC Die Process Characteristics
- Bosch Accelerometer MEMS Die
- Bosch Gyroscope MEMS Die
- MEMS Die View and Dimensions
- MEMS Die Marking
- MEMS Die Cross-Section
- MEMS Die Process Summary
Physical Comparison
- Packaging
- MEMS Accelerometers
- MEMS Gyroscopes
- ASICs
- Comparison Summary
Manufacturing Process
- Global Overview
- Bosch ASIC
- Bosch MEMS Accelerometer
- Bosch MEMS Gyroscope
- Packaging
Cost Analysis
- Yield Hypothesis
- Bosch ASIC Die
- Bosch Accelerometer MEMS Die
- Bosch Gyroscope MEMS Die
- Wafer Cost
- MEMS Die Cost
- Packaging & Final test Cost
- Component Cost
- MEMS Gyroscope Front-End Cost Comparison
Selling price
Feedbacks
Yole Group corporate presentation
- Smartphone OEM: Apple
- Foundry and MEMS IMU supplier : BOSCH
This full reverse costing study provides insight into technology data, manufacturing cost and selling price of the BOSCH Inertial Measurement Unit (IMU) three-axis angular rate sensor and three-axis acceleration sensor found in the latest iPhone 14 Pro.
We believe that this IMU is a custom version of BOSCH’s 6-axis device, made for Apple and integrated into the latest iPhone 14 Pro.
With dimensions of 3.0 mm x 3.0 mm x 0.6 mm, it can be integrated into smartphones and wearables.
While it uses the same sensor processes as BOSCH’s previous generation of 6-axis IMU devices, the designs have been changed for both the Micro-ElectroMechanical System (MEMS) accelerometer and the MEMS gyroscope. The component also integrates a new generation of the Application Specific Integrated Circuit (ASIC).
Moreover, the MEMS accelerometer has 7 sensing axes. Each axis ensures the performance of the crash detection function.
Furthermore, the report includes detailed analysis of the new hermetic sealing technology developed by BOSCH called Laser ReSeal. Bosch uses this process in the MEMS gyroscope cavity manufacturing process.
Additionally, the report includes the physical comparison of the package, the MEMS accelerometer and the MEMS gyroscope dies, the ASIC dies for the BOSCH IMUs found in the iPhone 14 Pro and iPhone 13 Pro Max. It also compares the front-end cost of the MEMS gyroscope wafers.