Technology, Process and Cost

Fan-Out Packaging Processes Comparison 2020

By Yole SystemPlus

In-depth technical and cost overview of key Fan-Out process technologies form Infineon, nepes, TSMC, SEMCO and ASE.


  • Comparative study with photos and cross-sections
  • Precise measurements: line/space, materials, dimensions
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Cost comparison

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