Market and Technology Trends

High-End Performance Packaging 2023

By Yole Intelligence

High-end packaging revenue will reach $16B by 2028, with a 40% CAGR22-28, thanks to 3D Stack memories and chiplet based products as main contributors. 


Key Features

The High-end Packaging market was worth $2.2B in 2022 and is projected to reach over $16B by 2028, with a CAGR2022-2028 of 40%. Breaking it down further into its end-markets, the biggest market in High-end Performance Packaging is ‘Telecom & Infrastructure’, with more than 60% of the market revenue in 2022. But it should be surpassed by ‘Mobile & Consumer’ market by 2027. Equally important is that the fastest end-market growth in High-end Packaging is coming from ‘Mobile & Consumer’ and ‘Automotive & Mobility’, at 50% and 32% CAGR, respectively. 3D Stack memories - HBM, 3DS & 3D NAND are the biggest contributors, representing more than 70% combined market share by 2028. The top four fastest-growing platforms are 3D SoC, Active Si Interposer, embedded Si bridge & 3D NAND stack. 

What’s new? 

  • New technology platforms added;
  • New assumptions;
  • Forecast updated

Product objectives

  • Identify and describe which technologies can be classified as ‘High-end Performance Packaging’
  • Define High-end Performance Packaging
  • Analyze key market drivers, benefits, and challenges of High-end Performance Packaging, by application 
  • Describe the different existing technologies, their trends and roadmaps
  • Consider the supply chain and High-end Performance Packaging landscape
  • Update the business status of High-end Performance Packaging technology markets
  • Provide a market forecast for the coming years, and estimate future trends

Do you have an account?

Sign in to your account to access your services