Technology, Process and Cost

HiSilicon Kirin 9000s SoC in Huawei Mate 60 Pro

By Yole SystemPlus

Full reverse costing study on technology data, manufacturing cost and selling price of the HiSilicon 9000s SoC in Huawei Mate 60 Pro


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

What's New

  • The first SMIC 7nm (N+2) for consumer product
  • The first domestic advanced SoC from design to chip manufacturing in China

Product Ojectives

  • Provide technology data, manufacturing cost and selling price.
  • Teardown on the main board of Huawei Mate 60 Pro to reveal the components around HiSilicon H9000s chip
  • Physical analysis of packaging and processor die by CT-scan, EDX, optical microscope and scanning electron scope
  • Physical analysis on SMIC 7nm (N+2) transmission electron microscopy .
  • Clear view on the technology and supply chain.
  • Provide information of SoC package size,  die size and die delayering to reveal the manufacturing and IP architecture.
  • Provide information of SoC manufacturing, its supply chain and cost structures.
  • Present a comparison of HiSilicon 9000 and HiSilicon 9000s chip from packaging to SoC die for understanding the evolution of Chinese high-end smartphone chip design.

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