InfiRay Micro III Camera Core Performance Analysis

Key features:

• Thermal camera market overview
• InfiRay company profile
• Camera presentation, functionalities, and use
• InfiRay Software Development Kit (SDK) and viewer software overview
• Image sensor standard characterization methodology from PISEO
• Sensor performance characterization
• Micro III correction function analysis
• Image processing and tone mapping algorithm analysis
• Camera performance comparison with other thermal camera modules
• PISEO’s opinion of the Micro III 384T IR Camera

Report objectives

Today, there is no independent thermal camera performance analysis covering both bolometric sensor and image precision and characteristics.
Based on PISEO's characterization standards, the thermal camera analysis from PISEO aims to:

• Verify the performance values communicated by the manufacturers,
• Compare performance with other thermal cameras,
• Study performance in different conditions.

This analysis is aimed at sensor designers, system architects, marketing teams and sales teams.

Available on our Yole Group All-Inclusive Imaging Package

Introduction 

Objectives of this report 

About PISEO

Authors of this report 

Table of contents 

Glossary 

Summary 

Thermal camera market overview 

• Thermal camera applications – market overview
• Thermal camera manufacturers / integrators MAP
• Thermal imager manufacturers MAP

InfiRay company profile

Camera presentation, functionalities, and use 

• Micro III camera presentation
• Microbolometric sensor
• Technical characteristics
• Camera tested

IRay SDK and viewer software 

• Micro III SDK and GUI
• GUI functionalities
• GUI functionalities – settings
• GUI functionalities – video
• GUI functionalities – video source
• GUI functionalities – colormaps
• GUI functionalities – AGC & filters
• GUI functionalities – advanced
• GUI functionalities – most recent GUI
• Presentation, functionalities, and use – synthesis

Image sensor standard characterization methodology 

• Image sensor characterization
• Blackbody setup
• MTF measurement
• Focal plane area temperature measurement
• Responsivity and NETD
• Bad pixel detection and operability
• Non-uniformity correction and RFPN
• Thermographic function

Sensor performance characterization

• Imaging performance parameter characterization
• Raw image definition and quality
• Responsivity / NETD / scene dynamic
• Operability
• Responsivity / NETD / scene dynamic
• Dependence on ambient temperature
• FPA temperature stability
• Residual fixed pattern noise
• Thermographic response
• Sensor performance characterization – synthesis

Micro III correction functions 

• Correction functions and algorithms
• Observed bit depth
• FPA temperature
• Bad pixel replacement algorithm
• Non-uniformity correction
• NUC performance
• NUC channel
• GAIN CALIBRATION
• Denoising function
• Correction functions – synthesis

Image processing and tone mapping analysis

• Image processing
• Tone mapping
• AGC block
• Algorithm – auto
• Algorithm – linear
• AGC
• Filtering functions
• DDE – overview
• DDE – « automatic » algorithm – static conditions
• DDE – « manual » algorithm – static conditions
• DDE – dynamic setup
• DDE – manual algorithm – dynamic
• Remanence – auto algorithm – filters OFF
• Image processing – synthesis

Conclusion 

• Camera performance comparisons
• PISEO’s Opinion of the Micro III 384T IR Camera

PISEO

Related reports 

Contact

Thanks to multiple drivers, the market for infra-red thermal imaging cameras and modules is expanding rapidly with many products on offer. There is, therefore, a need for users, integrators, and sensor manufacturers to discriminate between available products based on accurate and independent assessments of their performance and features.
This report is the fourth of its kind that will help thermal imaging camera and module market actors to better understand the characteristics of such products, enabling better strategic decision making.

PISEO’s findings

The Micro III camera module as tested by PISEO contains a strongly performing bolometric sensor, producing good quality images with low numbers of bad pixels. Unfortunately, the image quality is not enhanced well by the image processing firmware, which contains basic tone mapping functions but with errors on some of them. From a user’s perspective the software platform is not supportive enough to get the best out of the camera’s potential.

Compared to the Boson camera module from FLIR, which is a reference product in this field, the Micro III module is based on a higher quality sensor which should provide good image quality in many user cases. However, InfiRay’s algorithms for signal correction and image processing, which make the Boson camera’s approach interesting, largely underperform. The system engineer may be surprised by how difficult it is to reach the sensor’s potential.

The impression one gets from the analysis of the Micro III is that this module is better for internal InfiRay applications than for external ones. The multiple user interfaces and the approximation of the software tools suggests case-to-case improvements inspired by specific application contexts.

PISEO’s analysis

The analysis is based on physical measurements performed in PISEO’s lab and a deep analysis by PISEO’s experts.
The report presents:

• An analysis of the user functions of the camera.
• The results and analysis of the measured performance parameters of the embedded microbolometric sensor compared to the rated performance by the manufacturer.
• An analysis of the measured thermometric performance and optical architecture of the camera.
• An analysis of the sensor correction functions and algorithms.
• An analysis of the image processing flow from sensor to image as well as an assessment of image quality.
• Our opinion of the camera’s features and performance.
• A fair comparison of the performance against other marketed products.