Technology, Process and Cost

Intel Foveros 3D Packaging Technology

By Yole SystemPlus

A high-resolution LiDAR sensor featuring a bi-axial MEMS mirror scanner associated with an infrared laser and a RGB camera.

Reverse costing with:

  • Detailed photos
  • Precise measurements
  • Material analysis
  • Manufacturing process flow
  • Supply-chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price
  • Comparison with TSMC’s CoWoS

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