iPhone 15 Pro Max PMIC

Overview

• Executive Summary
• Reverse Costing Methodology
• Glossary

Physical Analysis

• Summary of the physical analysis
• Packaging
  • Opening
  • Cross-Section
• IC Die
  • Views & Dimensions
  • Delayering
  • Die Process
  • Cross-Section
  • Die Characteristics

Manufacturing Process Flow Analysis

• Global Overview
• IC Die Front-End Process
• IC Die Front-End Wafer Fabrication Unit
• Final Test & Assembly Unit

Cost Analysis

• Cost Summary
• Yields Explanation & Hypotheses
• Front-End Wafer Cost
• Back-End
• Die Cost
• Component Cost

Selling Price

• Definitions of Price
• Manufacturer Financials
• Estimated Selling Price

Feedbacks

Related Products

About Yole Group

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the 338S00946-B0 PMIC, which is found in the Apple iPhone 15 Pro Max, as well as in the iPhone 15 Pro 5G, iPhone 15 5G, all versions of iPhone 14 and 13.

The IC die is manufactured by Renesas. It also uses a Wafer Level Packaging technology.

• Renesas (Dialog)
• Apple
• TSMC

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis

Product Objectives

• Provide technology used by Renesas in PMIC in iPhone 15 Pro
• Detailed photos and material analysis
• Precise measurements
• Package Analysis
• Manufacturing Process
• Supply Chain
• Manufacturing Cost Analysis