Technology, Process and Cost
LPDDR5 Memory Comparison 2022
By Yole SystemPlus —
Mainstream low-power DRAM physical analysis, technology, and cost comparison: Samsung’s 1z generation, SK hynix’s 1y, and Micron’s 1y.
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Comparison Summary
Company Profile
- Samsung
- SK hynix
- Micron
Market Analysis
- DRAM Long Term Dynamics
- DRAM Market Dynamics
- DRAM Market Share
Physical Analysis
- Summary of the Physical Analysis
- Memory Disassembly Samsung/SK hynix/ Micron LPDDR5
- Smartphone Teardown
- Memory Package Analysis
- Package View & Dimensions
- Package Cross Section
- Package Opening
- Memory Die Analysis
- Memory Die View & Dimensions
- Memory Die Cross-Section
- Memory Die Delayering & Process
- Samsung Memory
- Micron Memory
- SK hynix Memory
Physical Analysis Comparison
Memory Manufacturing Process (Samsung/SK hynix/Micron)
- Memory Die Front-End Process
- Memory Fabrication Unit
- Final Test & Packaging Fabrication Unit
- Manufacturing Process Comparison
- Cost Analysis (Samsung/SK hynix/Micron)
- Summary of the Cost Analysis
- Yields Explanation & Hypotheses
- Memory (Samsung/SK hynix/Micron)
- Memory Die Front-End Cost
- Memory Die Probe Test, Thinning & Dicing
- Memory Die Wafer Cost
- Memory Die Cost
- Packaging Cost
- Component Cost
Comparison Cost
- Wafer Cost Comparison
- Die Cost Comparison
- Component Cost Comparison
- Cost per Gb Comparison
Selling Price
Feedback
Related Analyses
System Plus Consulting Services
DRAM revenue for 2021 is expected to reach $95B as prices increase by ⁓16% due to undersupply. Almost 35% of DRAM bit demand came from mobile applications in 2021. Mobile bit demand growth increased in 2021 due to higher 5G adoption and consumers replacing handsets after the 2020 Covid-19 lockdowns.
High-end smartphones are equipped with superior LPDDR5 memory to support ultra-high-performance camera applications and artificial intelligence (AI), providing consumers with high-quality images and videos. LPDDR5 memories have increased transfer speed compared to the previous generation low-power DRAM memories, providing cutting-edge data transfer speeds and advanced performance surpassing the previous generation. The reduced operation voltage decreases power consumption, allowing consumers to benefit from a long-lasting device battery. LPDDR5 characteristics empower devices to match both consumer needs and technology innovations.
In this report, we present a technology and economical comparison of low-power mobile DRAMS with different processes from three manufacturers: Samsung’s LPDDR5 using 1z technology, Micron’s LPDDR5, and SK hynix’s LPDDR5 using 1y technology. The DRAM memory manufacturing process is characterized by multiple patterning to create different structures. Production of denser dies significantly increases DRAM manufacturing productivity.
Three DRAM memories extracted from high-end smartphones are analyzed here: Samsung’s 8GB LPDDR5, Micron’s 12GB LPDDR5, and SK Hynix’s 8GB LPDDR5. Also presented is a detailed study of Samsung’s 16Gb dies manufactured by EUV lithography technology, Micron’s 12Gb dies using 1y process, and SK Hynix’s 8Gb dies using 1y process, with a full analysis and comparison of the three LPDDR5 memories. Memory packages are torn down to reveal the DRAM dies integrated in the devices. A detailed study of LPDDR5 die cross-section and elaborated manufacturing steps is furnished, along with a physical analysis highlighting the wordline, bitline, and capacitor structures. The physical structures are matched to the manufacturing process flow.
This report provides a manufacturing cost analysis and an estimation of the manufacturers’ gross margin. Also featured is an exhaustive comparison of the DRAM package, die size and density, cross-section, and CMOS transistors, highlighting the similarities and differences and their impact on the wafer and die cost. Lastly, this report offers a cost comparison detailing the DRAM wafer cost, die cost, and cost per gigabit of the three memories.
Key features of the report:
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical analysis comparison
- Manufacturing process and cost analysis comparison