Technology, Process and Cost
Melexis MLX90809 Relative Pressure Sensor
By Yole SystemPlus —
Second generation integrated pressure sensor for harsh environments
Glossary
Overview / Introduction
- Executive summary
- MLX90809
Company profile
- Melexis
- X-Fab
Physical analysis
- Physical analysis methodology
- Package
Package
Package opening
Wire bonding
Package cross-section
- Pressure sensor die
Sensor die view and dimensions
Pressure sensor views
Pressure sensor delayering and main blocks
Membrane
Piezo-resistors
Pressure sensor cross-section
Sensor die process characteristic
Sensor Manufacturing Process
- Sensor Die Front-End Process and Fabrication Unit
- Pressure Sensor Die Process
- Packaging Process and Fabrication unit
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yield Explanation and Hypotheses
- Sensor Die
CMOS Wafer Front-End Cost
Back Side Process Wafer Cost
Back Side Process Step Cost
Probe Test and Dicing
Sensor Die Wafer Cost
Sensor Die Cost
- Packaged Component
Packaging Cost
Back End: Final Test
Component Cost
Estimated Selling Price
The MLX90809 is an integrated relative pressure sensor for industrial and automotive applications in harsh environments. It operates over temperatures ranging from -40°C to 150°C and pressures between 0 and 1 bar, with an accuracy of 1.5%. The circuit is available with analog or digital SENT protocol output.
It is easy to use, factory calibrated, fully programmable and integrates analog functions like voltage regulators. The internal diagnostic functions ensure that measurement accuracy is maintained over the time.
Melexis uses smart packaging that is cheap and easy to integrate into a system. The relative pressure measurement uses a soft coating rather than complex packaging with manifolds. The coating protects the silicon die while allowing movement of the membrane.
The MLX90809 is the second generation integrated relative pressure sensor from Melexis. The company has more than 10 years’ experience in pressure sensors and more than 20 years’ experience in MEMS interface ICs.
This report presents a detailed analysis of the sensor structure and its cost.
COMPLETE TEARDOWN WITH:
- Detailed photos
- Precise measurements
- Material analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Selling price estimation