Technology, Process and Cost Comparison
MEMS Microphones 2024
By Yole SystemPlus —
THIS REPORT IS SCHEDULED FOR Q4 2024
SPR24854
THIS TABLE OF CONTENTS IS FROM THE PREVIOUS EDITION - IT MIGHT BE UPDATED.
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
Company Profile
- Market
- Main Smartphone’s microphones integration
- Company Profile and Supply Chain
Physical Analysis
- Knowles
- Goertek
- AAC Technologies
- STMicroelectronics
- TDK-InvenSense
- TDK-Epcos
- Cirrus Logic
- Vesper
- For each microphone supplier:
- Microphone overview : Package, ASIC, MEMS
- Package cross-section
- MEMS die design and cross-section
- Technology evolution and physical comparisons of packages, MEMS, and ASIC dies for each manufacturer and between the manufacturers
MEMS Manufacturing Process
- Knowles
- Infineon
- STMicroelectronics
- InvenSense
- Wolfson
- Vesper
Technology Comparison
- Microphone Package Comparison
- Microphone MEMS Comparison
Cost Analysis
- Yield Explanations and Hypotheses
- Overall Comparison – Microphone Component Cost
- Overall Comparison – MEMS Wafer FE Cost and Die Cost
- Microphone Component Cost Breakdown
- Conclusions
Included : AAC microphone from iPhone 15, Omron product inside Samsung’s phone
Included : AAC microphone from iPhone 15, Omron product inside Samsung’s phone