Technology, Process and Cost
Mobileye’s EyeQ5 Mid SoC
By Yole SystemPlus —
Analysis of the newest generation of Mobileye’s EyeQ5M SoC, placed inside Aptiv’s ADCAM Mid ECU for the BMW iX. The first 7nm FinFET SoC designed for ADAS front camera.
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost, and selling price of the Mobileye EyeQ5M System-on-Chip (SoC).
In 2021, Mobileye’s newest generation EyeQ5M SoC was placed inside Aptiv’s ADCAM Mid ECU for the BMW iX (66 51 5 A56 C45). This market-leading camera-based ADAS once again boosts the automotive industry with its vision processor. After releasing the EyeQ4 processor in 2018, Mobileye keeps pushing towards more advanced mobility solutions. The EyeQ5M comes with 4.6 DL TOPS (int8), which is 2x more DL TOPs than the previous generation (the EyeQ4 High has 2 DL TOPS). The EyeQ5 represents two types: EyeQ5 Mid and EyeQ5 High. The light version, EyeQ5 Mid (which is abbreviated as EyeQ5M in this report), supports high-end ADAS/AV front camera up to L2+. Meanwhile, the EyeQ5 High supports ADAS/AV partial or full surround up to L4. According to Mobileye, this fifth generation of the EyeQ series aims to be the central processor for future autonomous driving and is capable of handling about 20 high-resolution sensors.
The EyeQ5M processor has a unique architecture which integrates eight CPUs, a multi-thread processor cluster (MPC), a vector microcode processor (VMP), a deep learning accelerator (called ‘XNN’ by Mobileye), and a programmable macro array (PMA). This SoC was codesigned by Mobileye and STMicroelectronics, with the software developed by Mobileye and manufactured using TSMC’s 7nm FinFET process with 15 metal layers. We assume that the packaging and final test is done by an OSAT in Taiwan.
To reveal all the details of the Mobileye EyeQ5M chip, this report features multiple analyses. These include a front-end construction analysis to reveal the interesting features of the TSMC 7nm process and a back-end construction analysis for packaging structure. Also featured is a detailed study of the SoC die analyses and its cross-sections. In addition to a complete construction analysis using SEM cross-sections, material analyses, and delayering, X-ray images are provided to reveal more structures of the chip packaging. And in the report’s final section, we furnish a complete cost analysis and a selling price estimation of the Mobileye EyeQ5M chip.
Product’s key features:
- Detailed photos
- Precise measurements
- Front-end structural analysis with TEM
- Back-end structural analysis with X-ray
- Floorplan
- Materials analysis
- Manufacturing process flow
- Supply-chain evaluation
Available on our Yole Group All-Inclusive Computing Package
Overview / Introduction
- Executive Summary
- Product Brief
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Profile
- Google Pixel Series
- Market Analysis
Physical Analysis
- Camera Module Teardown
- Mobileye Eye Q5M Package Analysis
- Views & Dimensions
- CT-Scan Image
- Cross-Section
- Mobileye Eye Q5M SoC Die
- Views & Dimensions
- Delayering
- Die Process
- Die Cross-Section
Manufacturing Process
- Global Overview
- Front-End
- Wafer Fabrication Unit
- Assembly Unit
Cost Analysis
- Cost Analysis Summary
- Yields Explanation & Hypotheses
- SoC Wafer Cost
- SoC Die Cost
- SoC Packaging Cost
- SoC Component Cost
Selling Price
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