Technology, Process and Cost
NFC Combo Embedded Secure Element from HUAWEI Mate 60 Pro
Technology, process and cost overview of NFC Combo Embedded Secure Element from Huawei Mate 60 Pro
SPR24835- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the NFC Combo eSE from Huawei Mate 60 Pro.
Huawei Mate 60 Pro is a high-end 2023 smartphone product of the Chinese Huawei corporation from its Huawei Mate series. We estimate that Tsingteng Micro is a provider of NFC chips for these smartphones.
Tsingteng Micro obtained a certification of NFC Mobile Device from NFC Forum Certification Program, called THN31S (NFC CLF + eSE single die). Since Tsingteng Micro is fabless company, we assume that the design is done internally, and the manufacturing of the die is outsourced to a 300 mm foundry.
The process use CMOS process with SRAM, Flash and ROM memory.
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Tsingteng Microelectronics
Physical Analysis
- Summary of the physical analysis
- Module Disassembly
- Packaging
- Die
Manufacturing Process Flow Analysis
- Global Overview
- Die Front-End Process
- Die Front-End Wafer Fabrication Unit
- Die Back-end
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Die Front-End Wafer Cost
- Die Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
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