Technology, Process and Cost
NXP i.MX 9352 Application Processor
By Yole SystemPlus —
NXP i.MX9352 is an applications processors that support edge computing and machine learning acceleration with security and power efficiency. The SoC architecture is built with Arm Cortex A55 core, low power security MCU and high-efficiency NPU.
SPR23762
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Module Disassembly
- Packaging Assembly
- SoC Die
Manufacturing Process
- Global View
- Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
- Summary
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- SoC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Report
About Yole Group
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the NXP i.MX9352 MCU.
The NXP i.MX 93 is a series of applications processors that support edge computing and machine learning acceleration with security and power efficiency. The SoC architecture is built with Arm Cortex A55 core, low power security MCU and high-efficiency NPU to boost the computing capability with AI functions of the chip. The processors target consumer IoT products, industrial and automotive applications.
In this report, we analyze i.MX9352 which is the version that contains two CPU cores at 1.7 GHz and two NPU cores. This SoC supports industrial applications such as human machine interface, EV charging and automation.
- NXP
- TSMC
Key Features
- Detailed photos
- Precise measurements
- Packaging structural analysis with X-ray, EDX, optical & scanning electron microscopy
- Front-end structural analysis with scanning electron microscopy
- Manufacturing process flow
- Manufacturing cost analysis