Technology, Process and Cost
NXP NFC Combo Embedded Secure Element from Apple iPhone 15 pro
By Yole SystemPlus —
Technology, process and cost overview of NXP NFC Combo Embedded Secure Element from Apple iPhone 15 pro
SPR24834
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- NXP
Physical Analysis
- Summary of the physical analysis
- Module Disassembly
- Packaging
- Die
Manufacturing Process Flow Analysis
- Global Overview
- Die Front-End Process
- Die Front-End Wafer Fabrication Unit
- Die Back-end
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Die Front-End Wafer Cost
- Die Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Report
About Yole Group
This full reverse costing analysis has been undertaken to offer insights into the technological specifications, manufacturing expenses, and retail pricing of the NXP NFC Combo Embedded Secure Element from Apple iPhone 15 Pro
This component finds application in various smartphones and wearable devices, including but not limited to the APPLE iPhone 15 Pro Max, SAMSUNG Galaxy S24 Ultra, and APPLE Watch series (such as the Watch Ultra, Watch Ultra 2, Watch 8, and Watch 9).
It is assumed that NXP designs the component in Eindhoven, Netherlands. Subsequently, the processes of die fabrication, dicing, and testing are presumed to be outsourced to a 300 mm foundry.
NXP
Apple
Samsung
TSMC
ASE Group
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis