OmniVision OX05B Global Shutter CIS

Overview / Introduction

• Executive Summary
• Reverse Costing Methodology
• OX05B
• Glossary

Company Profile & Supply Chain

• Omnivision

Physical Analysis

• Summary of the Physical Analysis
• Leopard Imaging Module Teardown
• Package Module Assembly
  • Package Overview & Dimensions
  • Package Cross Section
  • Package opening
• CMOS Image Sensor
  • Overview and Dimensions
  • Die Corners
  • Delayering - Microlenses
  • Delayering - NIR Enhancement
  • Delayering – CIS1 Transistors
  • Delayering – CIS2 Transistors
  • Cross-Section
  • Process Summary

Manufacturing Process Flow

• Global Overview
• CIS Manufacturing Process Flow
• CMOS Image Sensor Process & Fabrication Units
• Package Assembly

Cost Analysis

• Cost Summary
• Yields Explanation & Hypotheses
• Die Front-End Wafer Cost
• Wafer Level Packaging Cost
• Die Cost
• Component Cost

Selling Price

• Definitions of Price
• Estimated Selling Price

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About Yole Group

OmniVision’s 2.2 µm global shutter pixel brings compactness to in-cabin applications

The $2.3B Automotive CMOS image sensor (CIS) market is expected to see a CAGR of 5.4% through to 2029.  Much of this growth is expected to be from in-cabin applications, where a variety of features such as driver monitoring systems (DMS), occupant monitoring systems (OMS), facial recognition, gesture recognition etc. promise to improve safety, convenience, and the luxury experience.

Among these features is driver eye-tracking, which tends to rely on global shutter pixels to image the driver’s fast-moving pupils without deformation.  Smaller pixels allow higher resolutions to capture more information in a smaller module, but come with certain challenges, such as slower shutter speeds and noise from miniaturized pixel circuits.

The smallest global shutter pixel currently on the market is the OX05B from OmniVision, one of the four leading ADAS CIS manufacturers.  This pixel is 2.2 µm, and relies on a RGB-IR color filter pattern and the company’s Nyxel® technology, which uses texturing of the pixel surface and highly reflective isolation trenches to increase sensitivity to an industry leading 36% quantum efficiency at the 940 nm wavelength, a 3x boost from the previous generation.

To overcome the challenge of miniaturized pixel circuits, OmniVision uses a stacked pixel architecture from TSMC, which splits the pixel circuit between two wafers, effectively doubling the space available.  The circuit is connected by in-pixel Cu-Cu hybrid bonding and relies on compact 3D metal-insulator-metal capacitor storage nodes in each pixel.

This report features complete physical and reverse costing analysis of the OX05B CIS.  It presents results from optical and scanning electron microscopy (SEM) and chemical analysis by energy-dispersive X-ray (EDX) spectroscopy to examine the physical structure and processes of the CIS.  Reverse costing is performed based on inference of the manufacturing process and yields at each step.

• OmniVision
• Taiwan Semiconductor Manufacturing Company
• Xintec

Key Features

• Detailed photos
• Precise measurements
• Die analysis
• Package analysis
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Cost analysis

What's new?

• 2.2 µm global shutter achieved by in-pixel bonding and MIM-based storage node

Product Objectives

• Complete physical and reverse costing analysis of the OX05B global shutter CIS and its advanced package