Technology, Process and Cost

OmniVision OX05B Global Shutter CIS

By Yole SystemPlus

Deep dive into OmniVision’s 2.2 µm RGB-Ir global shutter pixel, featuring in-pixel bonding, MIM-based storage nodes, and Nyxel NIR-enhancement.


Key Features

  • Detailed photos
  • Precise measurements
  • Die analysis
  • Package analysis
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Cost analysis

What's new?

  • 2.2 µm global shutter achieved by in-pixel bonding and MIM-based storage node

Product Objectives

  • Complete physical and reverse costing analysis of the OX05B global shutter CIS and its advanced package

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