Oppo Reno3 5G Sub-6 Front-End Module

Overview/Introduction

 Oppo, Qorvo, Skyworks Company Profile

 Oppo Reno3 5G Teardown

Market Analysis: Supplier Ranking, Chipset Cost per Smartphone

Physical Analysis

• Physical Analysis Methodology
• Qorvo QM77040 4G/5G MB/HB PAMiD Analysis
  • Module Analysis
  • Module Opening: Power amplifier, Switch, RF IC, Filters
  • Module Cross-Section
  • Die Analysis: Switch, LNA, Filters
• Skyworks SKY58254 4G/5G B41/n41 PAM Analysis
• Skyworks SKY58255 4G/5G UHB PAM Analysis
• Skyworks SKY53728 5G UHB Diversity Module Analysis
• Skyworks SKY53735 4G/5G LM/LMB/MB/HB Diversity Module

Manufacturing Process Flow

• Die Process: LNA, Switch, Filters
• Wafer Fabrication Unit
• Packaging Process

Cost Analysis

• Cost Analysis Overview
• Main Steps Used in the Economic Analysis
• Yield Hypotheses
• Die Cost: PA, LNA, Switch, Filters
• Packaging Cost
• Module Cost

Estimated Price Analysis

Comparison with 5G PAMiD: Qorvo QM77040 with the Qualcomm QPM5670, and the Skyworks SKY58254 with the Qorvo QM78041 and the Qualcomm QPM6585

Study of innovative 5G Sub-6 modules from Qorvo and Skyworks integrated into Oppo’s phones.

Qualcomm is currently the leader of the 5G market with several design wins in 2019 and 2020. But the company is not the only supplier of modules for 5G Sub-6 GHz frequency band communication. Qorvo and Skyworks follow Qualcomm in the rankings and could overtake it in the next few years. In the Reno3 5G, Oppo chose these two suppliers for the Radio Frequency Front-End (RFFE) for 4G and 5G. Both bring good alternatives to Qualcomm’s components and offer cost-effective solutions.

Among the first 5G phones on the market in 2019, the Oppo Reno3 series has a different structure for the RF Front-End Module (FEM). The Pro version is based on a complete Qualcomm chipset from the modem to the antenna tuner. The standard version, studied in this report, features a modem and a transceiver from MediaTek and a complete RFFE split between Skyworks and Qorvo.
Qorvo supplied the QM77040 3G/4G/5G Mid/High Band (MB/HB) Power Amplifier integrated Duplexer (PAMiD), mostly with 4G refarming bands for 5G. The device features several dies showing different innovations from the latest generation of PA to generation 4 and 5 Bulk Acoustic Wave (BAW) filter.
Skyworks supplies all the others main components: 4G Low/Low-Mid/Mid/High-band (LB/LMB/MB/HB) Diversity module (SKY53735), 4G/5G B41/n41 PAMiD (SKY58254), 5G n78/n79 Low Noise PAMiD (L-PAMiD) (SKY58255), and 5G n78/n79 Diversity (SKY53728).
The report contains a complete analysis of the main FEM System-in-Package (SiP), including a detailed analysis of the switches, the Low Noise Amplifier (LNA), the filtering dies, and the internal/external Electromagnetic Interference (EMI) shielding. The report also features a cost analysis and a price estimation of the chipset. Finally, it also integrates a comparison of the Qorvo QM77040 with the Qualcomm QPM5670, and the Skyworks SKY58254 with the Qorvo QM78041 and the Qualcomm QPM6585.

 

Complete teardown with:

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Technical and cost comparison of the Qorvo QM77040 with the Qualcomm QPM5670 and the Skyworks SKY58254 with the Qorvo QM78041 and the Qualcomm QPM6585