Osram Eviyos LED for automotive headlamps

Overview

• Executive Summary
• Reverse Costing Methodology
• Glossary

Company Profil

• Ams – Osram
• KEW GBBMD1U EVIYOS

Physical Analysis

• Physical analysis methodology
• Package Views & Dimensions
• Package Opening
• Package Cross-section
• Component Views & Dimensions
• Component Cross-Section
• LED Delayering
• Driver IC Delayering
• Component Process Characteristics

Manufacturing

• Global Overview
• LED Die
• Driver Die
• C2W
• Package Assembly
• Final Test

Cost Analysis

• Economic Analysis Hypotheses
• Yields Explanation & Hypotheses
• Driver Die Cost
• LED Die Cost
• C2W Process Cost
• Packaging Cost
• Final Test
• Component Cost

Selling Price

• Definition of Price
• Component Price

Feedbacks

About Yole Group

Osram EVIYOS 2.0 21,600 pixel Intelligent HD LED

In the last Lighting for Automotive Report, issued 2022, we estimated that the global LED headlamp market would represent ~$24.6B in 2023. The market is dominated by No ADB LED headlamps, representing more than 84%, but matrix pixel LED headlamps are emerging. Between the basic ADB with less of 100 discrete LEDs and the more complex digital beam based (1.3Mpixel) based on a DLP component, Osram proposes the pixel ADB component Eviyos KEW GBBMD1U, a matrixed LED with 25,600 pixels assembled on and drive by an ASIC IC. Easier to integrates than the basic ADB and digital beam, the Osram Pixel ADB can be a game-changer in the ADB world and accelerate the popularity of this technology. Already integrated by Marelli in the last Volkswagen Touareg.

The Pixel LED Eviyos developed by ams-Osram, is a pixel ADB Device for automotive headlight. This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Eviyos KEW GBBMD1U from Osram.

The KEW GBBMD1U is a large matrixed LED die bonded on an ASIC driver die. Each microLED with a pitch of 40 µm, is directly drive by the ASIC die and the 25,600 microLEDs are drive individually. This pixel ADB  has been selected by Marelli for their high-end headlamp.

The complex electrodes and mirrors structures are manufactured on the microLED GaN wafer. After the dies are diced and bonded on the ASIC wafer. The ASIC die with the pixel LED is assembled on a substrate package. The manufacturing of the LED is realized by OSRAM and the drive die per ams.

This reverse costing study provides insights into technological data, manufacturing cost, and selling price of the Eviyos KEW GBBMD1U pixel LED. These analyses provide the technical intelligence necessary to understand this technology, the optical and SEM pictures with comments and dimension allow to understand the technology and the manufacturing process flow.

• ams Osram

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis