Technology, Process and Cost

Qorvo QM7810X 5G Sub-6 L-PAMiD with Rx Diversity

By Yole SystemPlus

Complete technology and cost analysis of the front-end module using advanced DSMBGA, the latest GaAs PA, enhanced LNA-on-SOI, and novel micro-BAW technology.

Complete teardown with:

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Technical and cost comparison between the QM78103 and QM78105
  • Die and packaging comparison with Broadcom’s and Skyworks’ FBAR-BAW technology

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