Technology, Process and Cost

Qualcomm SA8295P SoC in Snapdragon Cockpit Platform

By Yole SystemPlus

A full physical and cost analysis of Qualcomm SA8295P SoC in Snapdragon Cockpit Platform


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • SoC die floorplan
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

What's New

  • The newest version of Qualcomm Snapdragon cockpit platform

Product Objectives

  • Provide technology data, manufacturing cost and selling price.
  • Teardown details on Qualcomm 4th Gen. SA8295P Automotive Cockpit Platform to reveal the components supporting the SoC on the module board
  • Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
  • Clear view on the technology and supply chain.
  • SoC package size,  die size, die delayering to reveal the manufacturing
  • SoC floorplan to reveal the IP architecture.
  • Automotive SoC manufacturing, its supply chain and cost structures.

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