Technology, Process and Cost

Qualcomm Snapdragon 8 gen 3 SoC

By Yole SystemPlus

A physical analysis and cost analysis of the most advanced smartphone SoC from Qualcomm. 


Key Features 

  • Detailed photos​
  • Precise measurements​ on package and SoC die analysis
  • Materials analysis​
  • SoC die floorplan​
  • Package/die/floorplan comparison with the predecessor 
  • Manufacturing process flow
  • Supply chain evaluation​
  • Manufacturing cost analysis

What's new?

  • Analysis on the most recent Qualcomm advanced SoC for smartphone application

Product Objectives

  • Provide technology data, manufacturing cost and selling price.​
  • Teardown details on Xiaomi 14 to reveal the components supporting the SoC on the main board of the phone​
  • Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.​
  • TSMC 4 nm FEOL analysis with transmission electron microscopy (TEM).
  • Clear view on the technology and supply chain.
  • SoC package size, die size, die delayering to reveal the manufacturing ​
  • SoC floorplan to reveal the IP architecture.​
  • Smartphone SoC manufacturing, its supply chain and cost structures.

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