Technology, Process and Cost
Qualcomm Snapdragon X62 5G Modem-RF System
By Yole SystemPlus —
Analysis of the latest RF module solution for 5G extension into the fixed wireless application segment, provided by Qualcomm.
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Qualcomm 2021
Physical Analysis
- Modem Die X62
- Qualcomm PMIC PMX65
- Qualcomm QDM4302
- Qualcomm QPM5577
- Qualcomm Transceiver SDR735
- Package Views & Dimensions
- Package Opening
- Package Cross-Section
- Summary
- Die Views & Dimensions
- Die Delayering
- Metal layers
- Die Cross-Section
- Summary
Manufacturing Process
- Global Overview
- Qualcomm X62
- Qualcomm PMIC PMX65
- Qualcomm QDM4302
- Qualcomm QPM5577
- Qualcomm Transceiver SDR735
Cost Analysis
- Summary of the cost analysis
- Manufacturer Financial Ratios
- Yields Explanations & Hypotheses
- Wafers & Die Cost
- Packaging and Component Cost
- Qualcomm x62
- Qualcomm PMIC PMX65
- Qualcomm QDM4302
- Qualcomm QPM5577
- Qualcomm Transceiver SDR735
Selling price
- Qualcomm X62
- Qualcomm PMIC PMX65
- Qualcomm QDM4302
- Qualcomm QPM5577
- Qualcomm Transceiver SDR735
Cost comparison between Qualcomm X62 and Mediatek T750 chipsets
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Related Products
About Yole Group
Qualcomm, a global leader in 5G technologies, is working on enlarging wireless technologies’ usage and providing a complete RF chain from the baseband to the antenna. This year, the newest customer-promised equipment will be equipped with the latest modem-to-antenna solution – the X62 chipset – which is an established 5G solution in the fixed wireless application segment.
This full reverse costing study was conducted to provide insight on the technology data, manufacturing cost, and selling price of the Qualcomm x62 5G RF Chipset. This includes a detailed focus on the Qualcomm Snapdragon X62 5G Modem-RF system-on-chip; the Qualcomm power management integrated circuit (PMIC) PMX65; the diversity module QDM4302; the RF transceiver SDR735; and the 4G/5G power amplifier module integrated duplexer (PAMID) QPM5577.
Yole SystemPlus has analyzed the technologies of these components to provide insights on their structures, technology processes, cost of manufacturing, and final selling prices. We provide overviews of the packaging for each module and the PMICs, LNAs, complex switches, and TC-SAW and TF-SAW filter dies inside, with detailed optical and SEM pictures along with package and die cross-sections. Also provided is an EDX analysis that identifies all of the materials used. Moreover, we analyze the substrate types and describe the manufacturing processes for the components.
Yole SystemPlus has also analyzed a new, most-advanced technology-node baseband processor performed on 4 nm process. Finally, a new approach to complex switch manufacturing by using wafer bonding technology is shown.
Qualcomm
Foundries: GlobalFoundries, TDK Epcos, TSMC
Samsung
Mediatek
KEY FEATURES:
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Cost comparison between the Qualcomm x62 and Mediatek T750 chipsets.
WHAT'S NEW:
- Full reverse costing study of the Qualcomm x62 chipset, with a detailed physical and cost analysis of the following components:
- Qualcomm PMIC PMX65
- Qualcomm Snapdragon X62 5G Modem-RF System
- Qualcomm Diversity Module QDM4302
- Qualcomm PAMiD QPM5577
- Qualcomm RF Transceiver SDR735
- For each of these components, the package and the dies inside are analyzed. Also, optical and SEM images for the package and dies are made, package and die cross-sections are provided, and an EDX analysis on the materials is performed.
- Manufacturing process for each of the dies is studied and described.
- Supply chain is evaluated.
- Manufacturing cost and selling prices are estimated for all analyzed components.
- Cost comparison between the Mediatek T750 and Qualcomm x62 chipsets is performed.