Technology, Process and Cost

Qualcomm Snapdragon X62 5G Modem-RF System

By Yole SystemPlus

Analysis of the latest RF module solution for 5G extension into the fixed wireless application segment, provided by Qualcomm.


  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated selling price
  • Cost comparison between the Qualcomm x62 and Mediatek T750 chipsets.


  • Full reverse costing study of the Qualcomm x62 chipset, with a detailed physical and cost analysis of the following components:
  1. Qualcomm PMIC PMX65
  2. Qualcomm Snapdragon X62 5G Modem-RF System
  3. Qualcomm Diversity Module QDM4302
  4. Qualcomm PAMiD QPM5577
  5. Qualcomm RF Transceiver SDR735
  • For each of these components, the package and the dies inside are analyzed. Also, optical and SEM images for the package and dies are made, package and die cross-sections are provided, and an EDX analysis on the materials is performed.
  • Manufacturing process for each of the dies is studied and described.
  • Supply chain is evaluated.
  • Manufacturing cost and selling prices are estimated for all analyzed components.
  • Cost comparison between the Mediatek T750 and Qualcomm x62 chipsets is performed.

Do you have an account?

Sign in to your account to access your services