Technology, Process and Cost Comparison
RF Front-End Module Comparison 2022 – Focus on UWB Connectivity
By Yole SystemPlus —
Technical and cost overview of the evolution of radio frequency front-end technologies used for UWB connectivity
- Amkor
- Apple
- ASE
- Decawave
- Mini-Circuits
- Murata
- NXP
- Qorvo
- OSE
- Samsung
- SMIC
- Sony
- TDK
- TSMC
- UMC
- USI
- Xiaomi
Key Features
- Comparison between UWB chipsets
- Cost comparison between the main SoC
- Detailed photos
- Precise measurements
- Materials analysis
- Supply chain evaluation
- Manufacturing cost analysis
- Cost comparison between the main UWB chipsets
Product Objectives
- A focus on UWB connectivity from the smartphone and beacon perspectives
- Very few OEMs (Apple, Samsung, Google, Xiaomi) are using this technology and very few suppliers (NXP and Qorvo) are involved
- A complete cost and technical comparison for the chipset, from the SoC to the antenna for RF location
- Investigation of the first indoor location system based on RF signal
Last year, Yole SystemPlus opened hundreds of front-end modules (FEMs) and components to provide an overview of the radio frequency (RF) FEM market in selected flagship smartphones. Gathering the information into four reports, ranging from player’s evolution to world area analysis, offers us an opportunity to keep track of the evolution of this technology market.
This year, Yole SystemPlus again offers different volumes of technical and cost comparisons of smartphone RFFEMs. Every comparison report focuses on a specific subject. It could be a certain player’s evolution, a specific technology, or a comparison of flagship devices.
This particular volume provides insights into the technology and cost data for UWB connectivity in consumer applications, from the master device to the beacon. It features a comprehensive overview of the RFFEM architectures on the market, comparing available smartphones and tags from the following companies: Apple, Samsung, Xiaomi, and Google. The main players in system-on-chip supplying are revealed, along with the different choices in technology node, wafer supply, and system design. Also, this volume reveals how Apple, DecaWave (now Qorvo), and NXP are the only ones that offer the protocol features in the devices on the market. For this report, we chose to work closely on the master and the slave device, i.e., smartphone and tag, to highlight the main differences and design choices between the two.
With teardowns of the smartphones and tags, the main RF components have been extracted and physically analyzed, from the transceiver to the antenna. Packaging, sizes, and technologies are studied in order to provide a large panel of technical and economic choices and an overview of the market.
Every SoC component has been analyzed to better understand the manufacturing process cost.
Lastly, this report includes a technical and cost comparison of the SoC and chipset and attempts to explain the makers’ choices and supplier tendencies. Note that only UWB is integrated in this report.
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
Company Profile
- Apple, NXP, Qorvo
Physical Comparison
- System Overview, Size and Complexity
- Module Device Technology
- System-on-Chip Technology
Physical Analysis of SoC
- Summary of SoC Physical Analysis
- Apple iPhone 13
- Apple U1 (v4)
- Package Views, Dimensions & Opening
- Dies Views & Dimensions
- Dies Overview, Delayering and Main Block IDs
- Dies Cross-Section
- Dies Process Characteristics
- PCB Antenna
- Apple U1 (v4)
- Apple Tag
- Apple 25W
- Plastic Antenna
- Samsung Galaxy S22 Ultra 5G
- NXP SR100T
- Flex Antenna
- Samsung Galaxy Tag+
- NXP SR04B
- Flex Antenna
- Google Pixel 6 Pro
- Qorvo DW3720
- Flex Antenna
- Xiaomi Mi Mix 4
- Plastic Antenna
- Apple iPhone 13
Physical Comparison - SoC
- State of the Art – Die & Function
- State of the Art – Implantation
Manufacturing Process Flow
Global Overview
- Wafer Front-End Process
- Wafer Fabrication Unit
- Packaging process & Fabrication
- Cost Analysis
- Synthesis of the cost analysis
- Main Steps of Economic Analysis
- Yield Explanation and Hypothesis
- Cost Analysis of Apple SoC
- Wafer, Die and Component Cost
- Cost Analysis of NXP SoC
- Cost Analysis of Qorvo SoC
Cost Comparison
- Wafer Cost Comparison
- Die Cost and Price Comparison
- Smartphone and Tag BoM Cost Comparison
Customer Feedback
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