RFFEM Comparison 2023 – WiFi-BT-GPS Chipset

• Apple
• Broadcom
• GlobalFoundries
• HiSilicon
• Huawei
• MediaTek
• Motorola
• Murata
• NXP
• Oppo
• Qorvo
• Qualcomm
• Samsung
• Skyworks
• Sony
• Taiwan Semiconductor Manufacturing Company
• Tower Semiconductor
• Xiaomi

Overview / Introduction

• Executive Summary
• Key Take Away
• Reverse Costing Methodology
• Connectivity in Smartphones

Company Profile

• MediaTek, Broadcom, Qualcomm Skyworks, Qorvo, NXP

Physical Comparison

• SoC – Die & Function
• Front-End Module – Die & Function

Physical Analysis – SoC

• Summary of Physical Analysis
  • MediaTek MT6637
    • Package Views, Dimensions & Opening
    • Die Views & Dimensions
    • Die Overview, Delayering and Main Block IDs
    • Die Cross-Section
    • Die Process Characteristics
  • Broadcom BCM4777
  • Qualcomm WCN7851

Manufacturing Process Flow - SoC

• Global Overview
• Wafer Front-End Process
• Wafer Fabrication Unit
• Packaging process & Fabrication

Cost Analysis - SoC

• Synthesis of the cost analysis
• Main Steps of Economic Analysis
• Yield Explanation and Hypothesis
  • Wafer Cost Breakdown
  • Die Cost Breakdown
  • Component Cost Breakdown

Cost Comparison - SoC

• Wafer Front-End Cost
• SoC Component Cost

Physical Analysis – FEM

• Summary of Physical Analysis
  • Skyworks SKY5xx08 – 2.4 GHz FEM
    • Package Views, Dimensions & Opening
    • Dies Views & Dimensions
    • Dies Overview, Delayering and Main Block IDs
    • Dies Cross-Section
    • Dies Process Characteristics
  • Qorvo QM4x389 – 2.4 GHz/5.0 GHz FEM
  • NXP WLAN8101H/WLAN7201C – 2.4 GHz/5.0 GHz FEM
  • Qualcomm QXM108x – 2.4 GHz/5.0 GHz FEM

Manufacturing Process Flow - FEM

• Global Overview
• Wafer Front-End Process
• Wafer Fabrication Unit
• Packaging process & Fabrication

Cost Analysis - FEM

• Synthesis of the cost analysis
• Main Steps of Economic Analysis
• Yield Explanation and Hypothesis
  • Wafer Cost Breakdown
  • Die Cost Breakdown
  • Packaging Cost Breakdown
  • Component Cost Breakdown

Cost Comparison - FEM

• Wafer Front-End Cost
• Component Cost

Customer Feedback

Related Products

About Yole Group

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Chipset comparison

What's new

• Investigation of technology node evolution in the main SoC for Wi-Fi / BT / GPS protocol
• Comparison of front-end modules from the four main players in the high-end and mid-end phones supply chain
• Study of the processes involved in FEM – from RFSOI to BiCMOS SiGe technology

Last year, Yole SystemPlus examined hundreds of front-end modules (FEMs) and components to provide an overview of the radio frequency (RF) FEM market for select flagship smartphones. We gathered this information into four reports, ranging from player evolution to world area analysis, and offered an opportunity to track the evolution of this technology market.

This year, Yole SystemPlus again offers a variety of technical and cost reports for smartphone RFFEMs. Every comparison report focuses on a specific subject. It could be a player’s evolution, a specific technology, or a comparison of flagship devices.

This RFFEM Comparison 2023 report provides insights into the technology and cost data for Wi-Fi / GPS / BT connectivity in consumer applications. This report features a comprehensive overview of the RFFEM architectures on the market, comparing available smartphones from the following companies: Apple, Samsung, Motorola, and Xiaomi. The main players in system-on-chip supply are revealed as well, along with the different choices of technology node, wafer supply, and system design. This report also reveals how Skyworks, Qorvo, NXP, and Qualcomm offer FEMs for the various protocols’ features in the devices on the market.

Thanks to teardowns of the smartphones, the main RF components have been extracted and physically analyzed from a transceiver and FEM point of view. Packaging, sizes, and technologies are studied to provide a large panel of technical and economic choices and an overview of the market.

All SoC and PA / LNA / switch components have been analyzed to understand the manufacturing process cost.

This report includes a technical and cost comparison of the SoCs from HiSilicon, Mediatek, Broadcom, and Qualcomm, as well as chipsets from Murata, Skyworks, Qorvo, NXP, and Qualcomm. Furthermore, this report explains the makers’ choices and suppliers’ tendencies with the introduction of Wi-Fi 6 / 6E / 7 and satellite communication using GPS signals.

Please note that UWB is not covered in this report.