Technology, Process and Cost

Samsung 176 layer 3D NAND Memory

By Yole SystemPlus

Samsung’s seventh generation V-NAND using Cell-over-Peripheral architecture and double deck implementation


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Physical comparison of Generations 6 and 7
  • Manufacturing cost analysis
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Cost estimation
  • Cost comparison

What's new

  • New architecture/design
  • CMOS/peripheral logic circuit placement
  • Double deck process flow
  • Chips with double capacity
  • Density improvement

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