Technology, Process and Cost
SEMIKRON-Danfoss IGBT Power Module in IM L7 Electric Vehicle Inverter
By Yole SystemPlus —
Discover SEMIKRON-Danfoss DCM™ power module with unique DBB® technology (Cu ribbon and Sintering) with ShowerPower® 3D baseplate
SPR23750
DCM™ module with DBB® (Cu ribbon and Sintering) and ShowerPower® 3D baseplate
The new environmental regulations to reduce average CO2 emissions favor the automotive trend of greater vehicle electrification and faster deployment of Electric Vehicles/Hybrid Electric Vehicles (xEV). Yole Intelligence expects the xEV market to reach 49.5 million vehicles by 2028, and of it, BEV will represent 24.1 million vehicles.
Innovations in power module design are continuously being developed for enhanced performance. We find them in all power module structures, from the baseplate and substrate assembly down to the die attach, through to the electrical connections.
In 2018, Danfoss announced the introduction of the Direct Cooled Molded (DCM™) technology platform. This platform combines Danfoss’ unique technologies: Danfoss Bond Buffer® (DBB®) with sintered die attach and copper bonding, transfer molding processes for robust packages, and liquid cooling technologies, namely ShowerPower® SP3D®.
In this context, Yole SystemPlus provides a complete reverse costing study of the SEMIKRON-Danfoss IGBT Power Module in the IM L7 electric vehicle’s Inverter: DP700B750T105502.
This module uses an innovative chip assembly based on Copper Ribbon bonding and a sintering process for enhanced electrical performance. In addition, the ShowerPower® SP3D® “turbulator” baseplate is optimized for homogeneous cooling. Its cooling channel walls are designed to bring additional mechanical stiffness to the module compared to a pin fin baseplate, for example, which allows higher pressure in the cooling system.
According to the available data, this power module is most likely of 750V voltage class.
Supported by a complete teardown of the module, our report reveals SEMIKRON-Danfoss’s IGBT Power Module in IM L7 Electric Vehicle Inverter technology choices for its assembled module as well as the design of the dies inside it.
This report also provides insights into the module's technology, manufacturing cost, and selling price, as well as an estimated manufacturing cost of all the module’s parts.
Included is a physical comparison with automotive modules from Infineon (FF400R07A01E3 HybridPACK™ DSC S1) and StarPower (GD820HTX75P6H), as well as a cost comparison of the IGBT power modules from SEMIKRON-Danfoss and StarPower (GD820HTX75P6H).
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
Physical Analysis
- Summary
- Package Analysis
- Package View & Opening
- Package Cross-Section
- IGBT Die Analysis
- Die Views & Dimensions, Die Delayering
- Die Cross Section
- Diode Die Analysis
- Die Views & Dimensions
- Die Cross Section
Physical Comparison
- Danfoss vs Infineon vs StarPower IGBT modules Comparison
Manufacturing Process Flow
- Wafer Fab Unit
- IGBT Wafer Process Flow Sketches
- Assembly Unit
- Assembly Process Flow
Cost Analysis
- Main Steps of the Economic Analysis
- Yields Explanation and Hypotheses
- IGBT Wafer & Die Costs
- Diode Wafer & Die Costs
- Substrate Assembly Cost
- Packaging Cost
- Module Cost
Cost Comparison
- Danfoss vs StarPower IGBT modules Cost Comparison
Selling Price
Feedback
Related Products
About Yole Group
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Physical and cost comparisons with other modules
Produt objectives
- Reveal SEMIKRON-Danfoss’s technology choices for its DCM™ module
- Explore SEMIKRON-Danfoss Bond Buffer® (DBB®) technology
- Provide information on the ShowerPower® SP3D® baseplate from Danfoss.
- Provide exhaustive physical, technology, and manufacturing cost of all the module’s parts including the design of the Infineon dies inside it.
- Physical comparison with automotive modules from Infineon (FF400R07A01E3 HybridPACK™ DSC S1) and StarPower (GD820HTX75P6H).
- Cost comparison with IGBT power module from StarPower (GD820HTX75P6H).
SEMIKRON-Danfoss
Infineon
StarPower
Heraeus