Smartphone 3D Sensing Modules Comparison 2020

Overview/Introduction

• Executive Summary
• Glossary

Company Profile 

Market Analysis

3D Sensing in Smartphones

• Technology Overview
• Module Integration
  • Structured light
  • Time-of-Flight
  • Release timeline
  • Apple: iPhone x, iPhone 11
  • Xiaomi: Mi8 Explorer
  • Oppo: FindX, Rx17 pro
  • Huawei: Mate 20 pro, P30 pro
  • Vivo: Nex Dual Display
  • LG: G8 ThinQ
  • Samsung: Galaxy note 10+, Galaxy S10

Physical Analysis

• Physical Analysis NIR CIS
  • Sony 1st gen
    • Die overview and dimensions
    • Die process
    • Die cross-section
    • Die process characteristic
  • Sony 2nd gen
  • Omnivision
  • STMicroelectronics
  • Infineon/PMD
  • Panasonic
• Physical Analysis NIR VCSELLIDAR Module Cost
  • Lumentum
    • Die overview and dimensions
    • Die process
    • Die cross-section
    • Die process characteristic
  • ams
  • Trumpf

Cost Analysis

• Cost Analysis NIR CIS
  • Sony 1st gen
    • Total wafer and die cost
  • Sony 2nd gen
  • Omnivision
  • STMicroelectronics
  • Infineon/PMD
  • Panasonic
• Cost Analysis NIR VCSEL
  • Lumentum
    • Total wafer and die cost
  • ams
  • Trumpf

Technical and Cost Comparison

• Dot Projector
• NIR Camera module
• Time of Flight Camera module
• NIR CIS Die Comparison
• VCSEL Die Comparison

Company Services

The consumer 3D sensing module market is expected to reach $8.1B in 2025 from $2B in 2019, according to the “3D Imaging & Sensing 2020” report from Yole Développement. The main driver technologies are Time-of-Flight (ToF) for photography enhancement and Structured Light (SL) for facial recognition. From 2016 to 2019, a total of 22 smartphones integrating a 3D sensing module have been released, 13 with SL and 9 with ToF.

In this dynamic context, System Plus Consulting provides a deep comparative review of technology and cost of 11 3D sensing modules found in flagship smartphones, with a focus on Vertical Cavity Surface Emitting Lasers (VCSELs) and Near Infra-Red CMOS Image Sensors (NIR CIS).

This report offers technological and economical comparison of five VCSEL dies and six NIR CIS integrated by the major manufacturers, Apple, Samsung Xiaomi, Huawei, Oppo, LG and Vivo, in their flagship smartphones. The VCSELs are provided by three key suppliers – Lumentum, Trumpf and ams. The manufacturers of NIR CIS are numerous including Sony, Omnivision, Infineon, STMicroelectronics, and Panasonic.

The integration of the VCSELs and NIR CIS in smartphones is shown, and the analysis are based on full teardowns of these components to reveal the technological choices made by the different manufacturers. Also, the report assesses the various supply chain participants.

Finally, this report features a full technical and cost comparison of the 3D sensing solutions at the module level, with a focus on the VCSELs and NIR CIS.

Reverse costing with:

• Overview of the 3D sensing modules
• Detailed SEM and optical photos
• Precise measurements
• Module and die cross-sections
• Materials analysis
• Process analysis
• Supply chain evaluation
• Cost analysis
• Technical and cost comparison