APU - Smartphone SoC Floorplan Comparison 2024

Overview/Introduction

• Executive Summary
• SoC List & Overview
• Reverse Costing Methodology
• Glossary

Company Profile

• Company Profile
• Foundry Service
• Market Analysis

Physical Comparison

• SoC Package Comparison & Overview
• SoC Die Comparison & Detailed Analysis

Design Comparison

• SoC Architecture
• Compute Units
• • CPU
  • GPU
  • NPU
  • SRAM Cache

Floorplan Analysis

• Apple A17 Pro SoC
• Google Tensor Gen 3
• HiSilicon Kirin 9000s
• MediaTek Dimensity 9300
• Qualcomm SnapDragon 8 Gen 3
• Samsung Exynos 2400

Manufacturing Comparison

Cost Comparison

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Related Report

About Yole Group

A full comprison on high-end smartphone SoC die floorplan, physical structure and cost 

The luxury smartphone market is experiencing a dynamic shift driven by increasing consumer demand for high-performance and innovative features. This segment of the market is highly competitive, with manufacturers constantly striving to outdo each other through the integration of advanced System-on-Chip (SoC) technologies. At the heart of these technological advancements are the leading foundry service providers, TSMC and Samsung, whose state-of-the-art fabrication technologies are essential for the development of these high-end SoCs.​

This report provides a comprehensive comparison of the latest high-end smartphone SoCs, specifically focusing on the Apple A17 Pro, Google Tensor Gen 3, HiSilicon 9000s, MediaTek Dimensity 9300, Qualcomm Snapdragon 8 Gen 3, and Samsung Exynos 2400. Each of these SoCs is examined in detail, with a particular emphasis on their floorplans and IP core configurations. The report delves into the architectural and design choices made by each manufacturer, offering a detailed comparison of CPU, GPU, NPU and system level cache.​

In addition to the floorplan and IP core analysis, the report includes high-resolution photos of the SoC packages and die. A clear comparison table shows our main finding and the differences between each SoCs. These  insights provide a deeper understanding of the physical layout and dimensions of each chip. One of the most intriguing sections of the report is the comparison of Front-End-Of-Line (FEOL) processes between TSMC and Samsung. This analysis highlights the technological advancements between TSMC 3 nm and 4 nm FinFET and the 4 nm technology between two foundries. ​

The report also explores the smartphone SoC supply chain and provides a cost comparison. This section examines the dynamics of the supply chain offers a detailed analysis of the cost implications for each SoC. This comprehensive examination not only highlights the technological advancements in high-end smartphone SoCs but also provides critical insights into the economic factors driving this competitive market.​

• Apple
• Google
• Huawei
• HiSilicon
• MediaTek
• Qualcomm
• Samsung
• TSMC
• SMIC
• Intel
• Quliang Electronics

Key features

• Floorplan comparison on CPU, GPU, NPU and SRAM cache architecture
• Detailed SoC die floorplan​
• Optical/SEM/TEM photos of chip planar view & cross-section​
• Measurements​ on package and SoC die photos
• Package/die comparison
• FEOL comparison : TSMC 3 vs. 4 nm, TSMC vs. Samsung 4 nm
• Manufacturing process
• Supply chain comparison
• Manufacturing cost comparison

Whats new?

• MediaTek Dimensity 9300 
• Samsung Exynos 2400 
• Samsung FO WLP Packaging Technology

Product Objectives

• Understand the evolution of smartphone SoC technology
• Have a clear view of the advanced manufacturing node between major players.
• Comparison of the SoC die architecture among the main manufacturers
• Comparison of compute unit focusing on CPU, GPU, NPU and SRAM cache
• Provide detailed technology data on SoC die physical structure and comparison.​
• FEOL comparison between TSMC 3 & 4 nm which are the two technologies largely covering the competitive chip manufacturing
• Overview the high-end smartphone supply chain by comparison
• Provide the insight of economic factors in this market with the cost comparison