Market and Technology Trends

Status of the IC Substrate Industry 2024

By Yole Intelligence

This report is scheduled for Q3 2024


This Status of Industry Report comprises data on Advanced IC Substrates with scope focused on organic and rigid Advanced IC Substrates, Substrate like PCB (SLP) and Embedded Die, as well as glass core-based substrate emerging. These substrates are used for AP platforms such as Flip-Chip, Ultra High Density Fan-out and 2.5D/3D stacking. Report includes 2024-2029 market forecast (revenue, units and panel start), substrate and material manufacturer data (revenue, market share, CapEx), supply chain, roadmaps and industry news. Detailed are technologies used to fabricate such substrates, with outlined inflection points for materials and equipment.

Scope of the previous report

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