Technology, Process and Cost
TDK Invensense ICM-456xy Inertial Measurement Unit with the BalancedGyro technology
By Yole SystemPlus —
The new BalancedGyro technology from TDK Invensense enables vibration rejection and temperature stability performance in its latest ICM-456xy 6-axis IMU.
SPR24841
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Financial Statements – TDK Invensense
- TDK Invensense Supply Chain
- Product Specifications TDK Invensense ICM-456xy
Physical Analysis
- Synthesis of the Physical Analysis
- Summary of the Physical Analysis
- Package
- Package View & Dimensions
- Package Opening
- Package Cross-Section
- Die
- Views, Dimensions & Marking
- MEMS Sensing Area
- MEMS 3-axis Gyroscope
- MEMS 3-axis Accelerometer
- MEMS Cap
- Die Cross-Section: MEMS (Pads Opening)
- Die Cross-Section: MEMS (Sealing)
- Die Cross-Section: Sensor (Electrical Contacts)
- Die Cross-Section: Sensor (Standoffs)
- Die Cross-Section: Sensor (Mobile Elements)
- Die Cross-Section: Cap
- ASIC Delayering & Process
- Die Cross-Section: ASIC
Manufacturing Process Flow Analysis
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
Cost Analysis
- Synthesis of the cost analysis
- TDK Invensense Supply Chain
- Yields Explanation & Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- ASIC/MEMS Assembly Cost
- Total Front-End Cost
- Back-End : Probe Test & Dicing
- Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test & Calibration Cost
- Component Cost
Selling Price
- Definitions of Price
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
This full reverse costing study provides insight into technology data, manufacturing cost and selling price of the TDK Invensense ICM-456xy Inertial Measurement Unit (IMU) which feautures a robust monolithic 6-axis IMU, three-axis angular rate sensor and three-axis acceleration sensor.
TDK Invensense claims that the ICM-456xy is an ultra high-performance 6-axis MEMS motion sensor family with the world’s first BalancedGyro technology and lowest power consumption.
The BalancedGyro technology proposed by TDK Invensense is the first-of-its kind gyroscope MEMS architecture that enables supreme vibration rejection and temperature stability performance. TDK Invensense notes that this is an enhancement never seen before in a consumer gyroscope.
This new 6-axis IMU targets consumer market and is very suitable for wearable and hearable gesture and activity detection applications.
The TDK Invensense ICM-456xy consists of:
- The ASIC/MEMS die designed by TDK Invensense and manufactured by TSMC in Taiwan.
- LGA 14-pin package.
- TDK Invensense
- TSMC
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
Product Objectives
- To provide insight into technology data, manufacturing cost and selling price of the TDK Invensense ICM-456xy Inertial Measurement Unit (IMU) – the sensor using the BalancedGyro technology.