Technology, Process and Cost

Tesla FSD HW4 Chip in Autopilot 4.0

By Yole SystemPlus

A full physical and cost analysis of Tesla’s newest self-designed FSD chip


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

Product objectives

  • Provide technology data, manufacturing cost and selling price.
  • Teardown details on Tesla Autopilot to know the components around FSD chip
  • Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
  • Clear view on the technology and supply chain.
  • SoC package size, die size, die delayering and floorplan to reveal the manufacturing and IP architecture.
  • Automotive SoC manufacturing, its supply chain and cost structures.
  • A comparison of FSD chips in autopilot 3.0 & 4.0 of packaging, die and floorplan are presented to understand the evolution of Tesla’s self-designed processor.

What's new

  • Updated technology node compared to previous version
  • New IP architecture

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