Technology, Process and Cost
Tesla FSD HW4 Chip in Autopilot 4.0
By Yole SystemPlus —
A full physical and cost analysis of Tesla’s newest self-designed FSD chip
SPR23782
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile & Market
- Company Profile
- Market Analysis
Physical Analysis
- Module Disassembly
- Package Assembly
- SoC Die
- SoC Floorplan
Physical Comparison
Manufacturing Process Flow Analysis
- Summary
- SoC Die Front-End Process
- SoC Die Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Back-End 0 Wafer Cost
- Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
New Tesla FSD Chip in Autopilot 4.0
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Tesla FSD HW4 chip in autopilot 4.0.
Tesla started to volume ship self-designed FSD HW3 chip in Autopilot 3.0 in 2019. The FSD HW3 is a SoC that integrates ARM-based A72 central processing units (CPUs), graphic processing units (GPUs) operating at 1 GHz with 600 giga-floating-point-operations-per-second (GFLOPs) capability and neural processing units (NPUs) capable of up to 37 tera-operations-per-second (TOPS). Other IP blocks such as image signal processor (ISP), safety & security system, video processing system and low power double data rate 4 (LPDD4) memory interfaces are also integrated in the chip to realize the advanced driver assistance system (ADAS) application. In 2022, Tesla published the autopilot 4.0 which contains a new version of FSD HW4 chip.
This new FSD HW4 is assumed to be manufactured by using Samsung 7 nm FinFET technology with a new die architecture to boost the autonomous driving. In this report, we conduct a full physical analysis to understand this new version from packaging, die manufacturing to floorplan by using X-ray, optical microscope and scanning electron microscope (SEM). Detailed measurements on the chip are also provided in our analysis. In addition, a complete floorplan on the SoC die is included to disclose the newly developed IP design. Moreover, we show a comparison of packaging, die and floorplan between the FSD HW3 and HW4 chips in Autopilot 3.0 and 4.0. Last but not least, we furnish the report with a full cost analysis and price estimation of the component.
- Tesla
- Samsung
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
Product objectives
- Provide technology data, manufacturing cost and selling price.
- Teardown details on Tesla Autopilot to know the components around FSD chip
- Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
- Clear view on the technology and supply chain.
- SoC package size, die size, die delayering and floorplan to reveal the manufacturing and IP architecture.
- Automotive SoC manufacturing, its supply chain and cost structures.
- A comparison of FSD chips in autopilot 3.0 & 4.0 of packaging, die and floorplan are presented to understand the evolution of Tesla’s self-designed processor.
What's new
- Updated technology node compared to previous version
- New IP architecture