Technology, Process and Cost
Texas Instrument AM2634 Sitara MCU SoC
By Yole SystemPlus —
A full physical and cost analysis of Texas Instrument AM2634 MCU SoC.
SPR23744
Texas Instrument
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Module Disassembly
- Packaging Assembly
- SoC Die
- Floorplan
Manufacturing Process
- Global View
- Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
- Summary
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- SoC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Report
About Yole Group
Key features
- LaunchPadTM kit teardown
- Detailed photos
- Precise measurements
- Packaging structural analysis with X-ray, optical & scanning electron microscopy
- Front-end structural analysis with scanning electron microscopy
- Floorplan
- Manufacturing process flow
What's new
- An MCU with complex real-time processing function
- A SoC integrated with multiple R5F cores with tightly coupled memory (TCM) to reduce the need for external memory
- The chip is assembled by using TI’s nFBGA packaging technology
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Texas Instrument AM2634 SitaraTM MCU SoC chip
TI AM2634 MCU SoC is a quad-core Arm Cotex-R5F MCU supporting up to 400 MHz with real-time control and security. This high-performance MCU is designed to support industrial IoT and automotive application.
The die is manufactured by using 45 nm 1P8M technology.
Hypotheses: We assumed the die is designed and manufactured by Texas Instrument. The assembly and final test are assumed to be done by TI’s internal facilities.
