Technology, Process and Cost

Texas Instrument AM2634 Sitara MCU SoC

By Yole SystemPlus

A full physical and cost analysis of Texas Instrument AM2634 MCU SoC.


Key features

  • LaunchPadTM kit teardown 
  • Detailed photos 
  • Precise measurements 
  • Packaging structural analysis with X-ray, optical & scanning electron microscopy 
  • Front-end structural analysis with scanning electron microscopy  
  • Floorplan 
  • Manufacturing process flow  

What's new

  • An MCU with complex real-time processing function
  • A SoC integrated with multiple R5F cores with tightly coupled memory (TCM) to reduce the need for external memory
  • The chip is assembled by using TI’s nFBGA packaging technology

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