Technology, Process and Cost
TI AM65x Sitara APU
By Yole SystemPlus —
TI AM65x SitaraTM APU is manufactured by using 28 nm technology node by a 12-inch fab and assembled by using FCBGA with an integrated heat sink.
SPR24783
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Module Disassembly
- Summary of IC Analysis
- Packaging
- IC Die
Manufacturing Process Flow Analysis
- Global View
- Die Front-End Process
- Die Front-End Wafer Fabrication Unit
- Back-end 0
- Assembly & Final Test
- Summary
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Soc Die Front-End Wafer Cost
- SoC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
About Yole Group
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Texas Instruments AM65x SitaraTM APU, which is an Arm application processor built to meet the complex processing needs of modern industry 4.0 embedded products.
The sample analyzed in this report is derived from Texas Instrument (TI) AM65x/DRA80xM evaluation board. The board is equipped with AM6548/DRA804M Quad-Core Cortex®-A53 function equivalent processor. The AM65x SitaraTM family is a processor series built with Arm® Cortex®-A53, Arm® Cortex®-R5F MCU subsystem and Gigabit industrial communications subsystems (PRU_ICSSG) to realize high-performance industrial controls.
Texas Instrument, UMC
Product Objectives :
Revealing the manufacturing technology and showing the cost structure of TI AM65x Sitara APU.
Key features:
- Detailed photos
- Precise measurements
- Packaging structural analysis with X-ray, EDX, optical & scanning electron microscopy
- Front-end structural analysis with scanning electron microscopy
- Manufacturing process flow
- Manufacturing cost analysis