Technology, Process and Cost
TI C2000™ 32-bit MCU TMS320F28374S
By Yole SystemPlus —
The chip is assembled by using Texas Instrument PowerPadTM thermally enhanced package technology with the die manufactured with advanced node by a 12-inch fab.
SPR24833
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
- Physical Analysis
- Summary
- Packaging Assembly
- IC Die
- Manufacturing Process
- Global View
- Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
- Summary
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Wafer Back-end 0 Cost
- IC Die Cost
- Packaging Cost
- Component Cost
- Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
- Feedbacks
Related Report
About Yole Group
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the TI C2000™ 32-bit MCU TMS320F28374S.
TI C2000TM MCU is a 32-bit microcontroller family developed by Texas Instrument for building low-latency real-time control. The chips are also able to be paired with GaN and SiC power device to realize the capabilities for power and motor control in both industrial and automotive application.
Texas Instrument
Key features:
- Detailed photos
- Precise measurements
- Packaging structural analysis with X-ray, EDX, optical & scanning electron microscopy
- Front-end structural analysis with scanning electron microscopy
- Manufacturing process flow
- Manufacturing cost analysis
Product objective:
Revealing the manufacturing technology and showing the cost structure of TI C2000™ 32-bit MCU TMS320F28374S.