Technology, Process and Cost

TI C2000™ 32-bit MCU TMS320F28374S

By Yole SystemPlus

The chip is assembled by using Texas Instrument PowerPadTM thermally enhanced package technology with the die manufactured with advanced node by a 12-inch fab.    


Key features:

  • Detailed photos
  • Precise measurements
  • Packaging structural analysis with X-ray, EDX, optical & scanning electron microscopy
  • Front-end structural analysis with scanning electron microscopy
  • Manufacturing process flow
  • Manufacturing cost analysis

Product objective: 

Revealing the manufacturing technology and showing the cost  structure of TI C2000™ 32-bit MCU TMS320F28374S.

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