Technology, Process and Cost
Unicore Communications UM681 GNSS Chip
By Yole SystemPlus —
Unicore Communications' dual-frequency GNSS positioning chip powers drone, automotive, and precision agriculture applications.
SPR24837
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Summary of the physical analysis
- UM681EVM Disassembly
- Packaging
- IC Die 1 (Unicore Communications GNSS Die)
- IC Die 2 (Puya serial NOR flash)
Manufacturing Process Flow Analysis
- Overview (Die 1, Die 2)
- Front-End Process (Die 1, Die 2)
- IC Wafer Fabrication Unit (Die 1, Die 2)
- IC Back-End 0 (Die 1, Die 2)
- Final Test & Assembly Unit
Cost Analysis
- Cost Analysis Summary
- Yields Explanation & Hypotheses
- Front-End Cost (Die 1, Die 2)
- Probe Test & Dicing (Die 1, Die 2)
- Wafer & Die Cost (Die 1, Die 2)
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
The purpose of this study is to provide a comprehensive understanding of the Unicore Communications UC6580A found in the UM681 module, which is a Dual-frequency GNSS Positioning Chip. It supports L1 L5/L2 dual frequency single point positioning and multi system. UC6580 is suitable for global applications. It has 96 tracking channels, supports GPS, GLONASS, BDS, Galileo, NAV IC and QZSS multi constellation joint positioning. This full reverse costing analysis aims to explore critical aspects, revealing the physical characteristics, manufacturing process and costs, as well as estimating the selling price of this IC.
The physical analysis includes high quality images of both the cross-section and the top view of the two ICs, which allow for a thorough understanding of the technological process involved in the Unicore Communications GNSS Chips production and the Puya serial NOR flash die. The manufacturing process and the supply chain is simulated to give a precise estimation of both front End and back-End Cost including estimated final component price.
- Unicore Communications
- SMIC
- Puya Semiconductor
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis