Ultra-Wideband Comparison 2024

• Overview
  • Executive Summary
  • Product Specification
  • Reverse Costing Methodology
  • Glossary
• Company Profile
• Physical Analysis
  • Summary of the physical analysis
  • Module Disassembly
  • Packaging
  • Sensor Die
  • ASIC Die
• Physical Comparison
• Manufacturing Process Flow Analysis
  • Global Overview
  • xxx Die Front-End Process
  • xxx Die Front-End Wafer Fabrication Unit
  • Packaging process
• Cost Analysis
  • Cost Summary
  • Yields Explanation & Hypotheses
  • Soc Die Front-End Wafer Cost
  • SoC Die Cost
  • Packaging Cost
  • Component Cost
• Cost Comparison
• Selling Price
  • Definitions of Price
  • Manufacturer Financials
  • Estimated Selling Price
• Feedbacks
• Related Products
• About Yole Group

This full reverse costing study has been conducted to provide insights and compare on technology data, manufacturing costs and selling prices of the Ultra-Wideband solutions from NXP, Apple and Qorvo. These components find application in various smartphones and wearable devices, including but not limited to the SAMSUNG Galaxy S24 Ultra, APPLE iPhone 15 Pro Max, and Google Pixel 8 Pro.

Through teardowns of smartphones, the UWB SoC or modules have been extracted and subjected to physical analysis. This includes examining packaging, sizes, and technologies to offer a broad range of technical and economic options and provide an overview of the market. Finally, this report includes a detailed comparison of the technical specifications and costs associated with the solutions utilized.

NXP
Qorvo
Apple
Samsung
Google
UMC
TSMC
ASE Group
USI

Report objectives

This full reverse costing study has been conducted to provide insights and compare technology data, manufacturing costs and selling prices of the Ultra-Wideband solutions from NXP, Apple and Qorvo. These components find application in various smartphones and wearable devices, including but not limited to the Samsung Galaxy S24 Ultra, Apple iPhone 15 Pro Max, and Google Pixel 8 Pro.