Technology, Process and Cost
Vesper MEMS Piezoelectric Voice Accelerometers : VA1200 & VA1210
By Yole SystemPlus —
Detailed technology and cost comparison of the world’s first piezoelectric MEMS voice accelerometers, the VA1200 & VA1210, from Vesper.
- Manufacturer: Vesper
- Foundries: TSMC, GlobalFoundries
- Package & Test: AAC Technologies
Key Features
- Market overview
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Technology and cost comparisons for two MEMS voice accelerometers: VA1200 & VA1210
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile & Supply Chain
- Company Profile & Supply Chain
- Market data
Physical Analysis
- Vesper VA1200 & VA1210
- Package
- Package Views & Dimensions
- Package Opening & Wire Bonding Process
- Package Cross-Section
- ASIC die
- Views, Dimensions & Marking
- Delayering
- Main Blocks Identification
- Cross-Section
- Process Characteristics
- MEMS die
- Views, Dimensions & Marking
- Sensing Areas Details
- MEMS Cavity
- Cross-Section
- Process Characteristics
Physical Comparison
Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
Cost Analysis
- Synthesis of the cost analysis
- Yields explanation & Hypotheses
- ASIC Die
- MEMS Die
- ASIC & MEMS Front-End Cost
- ASIC & MEMS Back-End 0 : Probe Test & Dicing
- MEMS Front-End Cost per process steps
- ASIC & MEMS Wafer & Die Cost
- Component - VA1200 & VA1210
- Back-End : Packaging Cost
- Back-End : Final Test Cost
- Component cost
Cost Comparison
Estimated Price Analysis
Customer Feedback
Vesper, a global MEMS supplier of the most advanced piezoelectric sensors, introduced the world’s first analog piezoelectric voice accelerometers (bone conduction sensors) – VA1200 and VA1210. This new technology addresses applications requiring robustness and reliability. Vesper claims that its piezoelectric MEMS voice accelerometers have unique advantages such as fast startup time, water and dust resistance, wide dynamic range, and linearity.
The voice accelerometers developed by Vesper pick up the vibration of the user’s voice through the skull. They filter out background noise, such as music, wind, subway, and crowd noises. Unlike traditional voice accelerometers, the Vesper voice accelerometers pick up only the user’s voice.
Vesper developed the unique PiezoElectric Bilayer PEBL Technology, which uses two stacked thin AlN-based piezoelectric films and makes it possible to manufacture multiple MEMS products in a single process flow.
SystemPlus analyzed the technologies in Vesper’s MEMS voice accelerometers to provide insights into their structure, technology, processes, and manufacturing cost. We provide an overview of the packaging and the ASIC and MEMS dies, with detailed optical and SEM views of the MEMS internal structure, package, and cross-section. We analyzed their substrate types, identified the materials used and their composition, and described the MEMS manufacturing process.
Finally, the report includes a comparison between the first generation piezoelectric MEMS voice accelerometer, the VA1200, and the second generation, the VA1210. The devices are compared in terms of the packaging, the MEMS and ASIC dies, and the manufacturing cost.
