Tradeshows & Conferences


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Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community which constitutes the largest share of the semiconductor community in Europe, and the assembly and packaging community:

  • parallel technical sessions
  • an exhibition
  • additional  technical events (June 6, 2023)

Yole Group is part of the technical session with:

Packaging and Manufacturing Technology and Market Analyst
Yole Intelligence

Wednesday, June 7th
SESSION E: Panel Session
4:30pm: Advanced packaging technology & market trends

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