SEMI JAPAN: IMPORTANCE OF AI CHIP DESIGN AND CHIPLET MARKET GROWTH STRATEGY – WEBINAR

“The semiconductor packaging field has become a hot topic, and it is one of the driving forces that will greatly change the way semiconductors should be in the future. In particular, AI chips are capable of performing advanced arithmetic processing with extremely low power consumption compared to conventional CPUs. “

ABSTRACT
Advanced Packaging has become extremely important when it comes to follow the More than Moore trend ensuring high performance integration and functionality to continuously growing in complexity dies resulting in device performance and bandwidth increase. It allows also to compensate the rising costs associated to front-end manufacturing by making possible chiplet and heterogeneous integration. High-End Packaging with 2.5D & 3D integration is expected to be the fastest growing platform reaching $16B by 2028. Foundries and IDMs are leaders for 2.5D & 3D packaging solutions but OSATs are following this trend as well. Hybrid bonding with wafer to wafer, die to wafer approach is the hot topic technology breakthrough as it allows to achieve 10μm fine pitch and less. This enables denser 3D IC stacking of logic or memory dies, the interconnection of partitioned SoC dies and heterogeneously integrated packages. What is Yole’s definition for advanced packaging and for high-end performance packaging? From technology to market, an overview of innovations, applications, players & markets will be shared and debated to shed light on these questions and on 2.5D and 3D packaging impact on industry.