Tradeshows & Conferences
MINAPAD 2024
the Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
MiNaPAD represents a convergence of minds, technologies, and innovations that are actively shaping the future of micro and nano-electronics. Over the course of two dynamic days, industry leaders, esteemed researchers, and passionate enthusiasts will unite to explore the cutting-edge developments in semiconductor design, assembly, and packaging.
Immerse yourself in Parallel Technical Sessions led by industry experts, where you can delve into specialized topics and gain insights into the latest advancements and challenges in micro and nano-electronics. These sessions provide a platform for in-depth discussions and knowledge exchange that are essential for staying ahead in this rapidly evolving field. Experience an innovative Exhibition showcasing the latest technologies, products, and services from leading companies and organizations within the micro and nano-electronics industry. From groundbreaking innovations to practical solutions, the exhibition offers a unique opportunity to explore and interact with the latest developments shaping the future of the industry.
Join Yole Group at booth #33 and be part of this dynamic forum where ideas converge. Come and meet our team of experts to discuss our solutions and your questions on the subject.
Yole Group will be part of the program with
Rayane Mazari
Technology & Cost Analyst, Semiconductor Packaging
More info coming soon…
Rayane Mazari
Technology & Cost Analyst, Semiconductor Packaging
Rayane Mazari serves as a Technology & Cost Analyst, Semiconductor Packaging, at Yole SystemPlus.
Rayane’s mission is to aid in the development of reverse engineering & costing reports. She works closely with the devices and laboratory team to set up significant physical & technology analyses of innovative IC and processor chips. She has a background in microelectronics.
Rayane holds a Master degree in Instrumentation & Microelectronics Engineering from Aix Marseille University.
The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics. Founded in 1967, IMAPS has professional members in 23 North American chapters and 21 international chapters.