2.5D & 3D Packaging Comparison 2022

• NVIDIA
• APPLE
• Advanced Micro Devices
• Taiwan Semiconductor Manufacturing Company
• SK hynix
• Samsung

Advanced packaging with its 2.5D & 3D solutions has become critical and effective for increasing device performance and bandwidth.  There is an increased implementation of high-end-system units in high-performance computing, networking, artificial intelligence, autonomous driving, personal computing, and gaming.  2.5D & 3D packaging market revenue is expected to grow at a 29% CAGR, from $3.25B in 2021 to over $15B in 2027, with telecom and infrastructure applications having the biggest market share.

The slowing down of scaling methods, along with diversifying demands for high performance and a smaller footprint package, has pushed designers to adopt advanced packaging solutions to achieve high-performance needs and extremely high die-to-die interconnect density. 2.5D & 3D packaging solutions are becoming complex, and more players have entered the market to provide enhanced performance in their products. An escalating demand for enhanced performance with ultra-high routing has been achieved by heterogeneous integration, hence the adoption of 2.5D & 3D packaging technologies.

This report analyses different components with 2.5D & 3D packaging structure:

• AMD Mi210 uses a complex package featuring an elevated fan-out silicon bridge needed for high-density interconnection between the processor die and the HBM2E memory. An ultra-thin silicon bridge chip is embedded within molding material, forming a molding interposer.
• AMD Ryzen 7 uses a 3D multichip integration, which is TSMC’s system on integrated chip (SoIC) technology, offering exceptional bonding pitch, scalability, and high-power efficiency compared to conventional 3D integration using micro bumps. This solution is achieved by direct hybrid bonding of copper pads of different dies.
• Apple M1 Ultra features UltraFusion technology, realized by a chip-first / RDL-last process flow, which leads to the conclusion that the Apple M1 Ultra uses TSMC InFO-L to enable two processor dies to communicate by a silicon bridge (LSI).

This report features multiple analyses focusing mostly on the different advanced packaging solutions. A light analysis of the processor dies, and the memory dies integrated in the different packages, is also included. Additionally, a complete analysis using optical and scanning electron microscopy (SEM) cross-sections reveals the chip integration and placement in the package that determines the packaging technology used. A back-end construction analysis reveals the packaging structure. We also show coherent tomography (CT) 3D X-ray scans to reveal the layout of the chips in the different packages analyzed. The packaging assembly process is described for each technology employed in the different components.  Furthermore, this report includes a cost analysis of each component. Lastly, we furnish a cost analysis comparison to determine the various cost factors in each assembly process, and complete component cost.

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Physical analysis, manufacturing process comparison
• Cost comparison

What's new

Comparison of:

• Processors using advanced technology node
• Innovative packaging technologies
• Use of silicon interposer compared to bridge die or mold interposer
• TSMC SoIC system on integrated chip technology used in AMD V-cache
• Adoption of hybrid bonding technology instead of bumping in AMD V-cache
• Packaging solution using an elevated / embedded bridge in molding
• Organic interposer instead of a silicon interposer
• Apple’s unprecedented innovation of 2.5D packaging that uses two M1 Mmx SoC dies that are connected by a local silicon interconnect to other technologies
• TSMC’s InFO-L (UltraFusion) technology to other advanced packaging technologies

Overview/ Introduction

• Executive Summary
• Datasheet
• Reverse Costing Methodology
• Glossary

Company Profile & Supply Chain

• Company Financials
• Packaging Technologies
• Market Analysis

Teardown Analysis

• Summary
• Physical Analysis
• (NVIDIA A100, AMD MI210, APPLE M1 ULTRA, AMD RYZEN 7 5800x V-CACHE)
• Board Teardown
• Package Analysis
• Package Dimensions & Overview
• Package Opening
• Package X-Ray Images
• Package Cross Section 
• Dies Analysis

Manufacturing Process

• Summary
• (NVIDIA A100, AMD MI210, APPLE M1 ULTRA, AMD RYZEN 7 5800x V-CACHE)
• Front End Manufacturing process
• Fab Unit
• Package Assembly
• Package Assembly Process Flow

Cost Analysis

• Summary
• Yields
• (NVIDIA A100, AMD MI210, APPLE M1 ULTRA, AMD RYZEN 7 5800x V-CACHE)
• Dies Cost
• Package Assembly Cost
• Complete Component Cost

Estimated Manufacturer Price Analysis

• (NVIDIA A100, AMD MI210, APPLE M1 ULTRA, AMD RYZEN 7 5800x V-CACHE)
• Estimation of the Manufacturer Price

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