Smart Systems along the entire value chain
The Smart Systems Integration Conference will cover all aspects of system integration, from System on Chip (SoC) via System in Package (SiP) to System of Systems (SoS) – both, hardware and software aspects . Its key mission is to connect the smart systems community and to align research activities along the whole value chain for future smart and sustainable system solutions.
The conference connects researchers from academia and industry as well as policy and decision makers.
Yole Group will be part of the speakers with:
Stefan CHITORAGA
Technology and Market Analyst – Packaging and Assembly
Yole Intelligence part of Yole Group
Wednesday, March 29
12:00pm: Technology & Market Trends for Advanced Packaging
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Stefan Chitoraga
Technology & Market Analyst, Semiconductor Packaging
Stefan Chitoraga is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Within the Manufacturing & Global Supply Chain activities at Yole Group, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market products and custom consulting projects.
Prior to Yole Group, Stefan served as a package design engineer at Teledyne E2V for 4 years, where he oversaw the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations. Furthermore, he spent 2 years at STMicroelectronics where he developed a new IC Substrate design, for organic package for SerDes applications.
Stefan holds a Bachelor’s in electronics and computer science for industry applications from the Polytech Grenoble (France).
