ANALYST THURSDAY – What’s under the hood of a flagship phone: IPhone vs Android?Sign in for replay
Yole Group analysts will discuss the major differences between the two main categories of smartphones, those from Apple and a flagship Android, with a focus on computing, biometrics, RF, and packaging technology.
The contrasting evolution of the two smartphone ecosystems has led to divergent hardware approaches to many of the typical functions found in a smartphone. In this webinar, Yole Intelligence and Yole SystemPlus analysts will discuss the critical differences between top-of-the-line iPhone and Android smartphones, with a focus on computing, RF connectivity, security biometrics, and packaging technology. Additionally, the Yole Group analysts will look into the future at what new features and technologies could be anticipated in these focus areas.
This webinar will highlight:
- Processor design differences, specifically CPU cores, GPU cores, AI acceleration, and cache size
- Processor foundry nodes and floorplan comparison
- Different processor packaging approaches taken by Apple and the flagship Android
- The vastly different approaches to security biometrics
- How RF connectivity evolved to two different ecosystems
- A look into the future: will these factors remain on different paths, or could we see some convergence?
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Technology & Cost Analyst, Computing
Ying-Wu Liu is Technology & Cost Analyst, Computing at Yole Group.
Ying-Wu ’s core expertise is Integrated Circuits technologies. With solid expertise in physical and electronical analysis of devices and experiences in wafer manufacturing and technical supports with international clients, Ying’s mission is to develop reverse engineering & costing analyses.
She works closely with different laboratories to set up significant physical analyses of innovative IC chips. Based on the results, Ying identifies and analyzes the overall manufacturing process and all technical choices made by the ICs makers to understand the structure of the device and point out the link between cost and technology.
Prior to Yole Group, Ying worked as Technical Support Manager at KEOLABS, in France and spent nearly 4-years as an integration/R&D engineer in semiconductor foundries in Taiwan.
Ying holds a master’s degree in Theoretical Physics from the National Tsing Hua University (Taiwan), and a master in Integration, Security and Trust in Embedded systems from the Grenoble INP, ESISAR (France).
Technology & Market Analyst, Semiconductor Packaging
Gabriela Pereira is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Working within the Manufacturing & Global Supply Chain activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects.
Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects.
Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.
Team Lead Analyst, RF Devices & Technology
As a Technology & Market Analyst, specialized in RF devices & technologies within the Power & Wireless division at Yole Intelligence, part of Yole Group.
Cédric Malaquin is involved in the development of technology & market reports as well as the production of custom consulting projects. Prior his mission at Yole, Cédric first served Soitec as a process integration engineer during 9 years, then as an electrical characterization engineer during 6 years. He deeply contributed to FDSOI and RFSOI products characterization. He has also authored or co-authored three patents and five international publications in the semiconductor field.
Cédric graduated from Polytech Lille in France with an engineering degree in microelectronics and material sciences.
Senior Technology & Market Analyst, Memory
John Lorenz is Senior Technology & Market Analyst, Memory at Yole Group.
John is in engaged with in-depth analysis of the dynamic memory market for the logic segment of advanced semiconductors, with a primary focus on processors. He oversees the Yole Group’s DRAM market research.
Prior to joining Yole Group, John held various engineering and strategic planning roles over 15 years at Micron Technology.
John has a Bachelor of Science degree in Mechanical Engineering from the University of Illinois Urbana-Champaign (USA), with a focus on MEMS devices.
Axel Clouet, PhD.
Technology & Market Analyst, Imaging
Axel Clouet, PhD. is Technology & Market Analyst, Imaging at Yole Group.
Alex is a member of Imaging & Display team, within the More than Moore activities. He contributes daily to technology & market analyses on various imaging technologies and participates in the production of the relevant Yole Group's products.
Previously, Axel obtained an MSc from Grenoble Institute of Technology (FR) and a Ph.D. from the University of Grenoble (FR) in collaboration with CEA-LETI, where he worked on color and noise aspects in CMOS image sensors. He is the author of various scientific papers and conference presentations.