Advanced packaging has given a significant boost to the memory packaging industry, driving growth and innovation

Product Related

Advanced packaging has become a key enabler of technological progress for NAND and DRAM.


  • The overall memory packaging revenue is estimated to reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.
  • DRAM will grow with a CAGR22-28 of around 13%, reaching around US$20.7 billion in 2028, while NAND will grow at a faster pace, with a CAGR22-28 of around 17%, and its packaging revenue is forecast to reach around US$8.9 billion by 2028.
  • Wire-bond dominates the memory packaging market, followed by flip-chip.
  • OSATs account for more than one-third of the memory packaging revenue.

Overall memory packaging revenue is estimated to have been US$15.1 billion in 2022, excluding testing. This corresponds to around 10% of overall stand-alone memory revenue, around US$144 billion in 2022. Yole Intelligence, part of Yole Group, forecasts that revenue will reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.

Thibault Grossi Senior Technology and Market Analyst, Semiconductor & Software Division at Yole Intelligence
“In terms of packaging revenue, DRAM will grow with a CAGR22-28 around 13% while NAND will grow faster, with a CAGR22-28 of 17%. Other memory technologies, such as NOR Flash, EEPROM , SRAM , and emerging NVM , are forecasted to grow with a CAGR22-28 of around 3%.”

AP has become a key enabler of technological progress for NAND and DRAM. Among the different AP approaches, hybrid bonding has emerged as the most promising solution to manufacture higher bit density and higher-performance memory devices.

Whether its use is intended to enable higher performance or smaller form factors, advanced packaging is an increasingly important factor in the memory value equation. From representing about 47% of memory packaging revenue in 2022, AP will represent 77% by 2028.

In this context, Yole Intelligence releases its new product: Memory Packaging 2023 report. In this study, the company – part of Yole Group – presents an overview of the semiconductor memory market, provides an understanding of memory packaging technologies and markets, and offers market forecasts for memory packaging. This report also describes the memory packaging business and delineates and analyzes the competitive landscape.

Titre du visuel

june 2021

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Thematic(s) :

Wire-bond is the dominant packaging approach. It is widely used for mobile memory and storage applications, followed by flip-chip packaging, which continues expanding in the DRAM market.

The adoption of flip-chip packaging with short interconnects is essential to enable high bandwidths per pin. While wire-bond packaging may still meet DDR 5 performance requirements, analysts expect flip-chip packaging to become a must-have for DDR6.

Leadframe remains widely used for NOR Flash and other memory technologies and is the package with the highest volume of unit shipments.

WLCSP is being increasingly adopted for consumer/wearable applications requiring small form factors, such as True Wireless Stereo earbuds. It is found in low-density memory devices such as NOR Flash, EEPROM, and SLC NAND.

Simone Bertolazzi, Ph.D., Senior Technology & Market Analyst, Memory, at Yole Intelligence
“AP is becoming increasingly important in the memory business, with flip-chip packages becoming the norm for DRAM modules in data centers and personal computers. The demand for HBM is growing fast, propelled by AI and high-performance computing applications. Hybrid bonding is part of the 3D NAND scaling path”.

Yole Intelligence’s Memory team invites you to follow the technologies, related devices, applications, and markets on

In this regard, do not miss:

Programs and additional information will come soon. Stay tuned on, Events section!


  • AP : Advanced Packaging
  • NAND : Flash memory with logical NAND-type structure
  • DRAM : Dynamic Random-Access Memory
  • NOR : Flash memory with logical NOR-type structure
  • EEPROM : Electrically Erasable Programmable Read-Only Memory
  • SRAM : Static Random-Access Memory
  • NVM : Non-Volatile Memory
  • DDR : Double Data Rate
  • WLCSP : Wafer Level Chip Scale Packaging
  • HBM : High Bandwidth Memory
  • AI : Artificial Intelligence

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