Technology, Process and Cost

Apple M1 Ultra SoC

By Yole SystemPlus

Full analysis of Apple’s M1 Ultra System-on-Chip (SoC). Apple’s most powerful desktop computer chip in 2022 and the first chip using TSMC’s InFO-L process to realize Apple UltraFusion.  


  • Company profile
  • Advance packaging technology introduction
  • Market analysis
  • Detailed photos
  • Precise measurements
  • Front-end structural analysis with scanning electron microscopy (SEM)
  • Back-end structural analysis with Coherent Tomography (CT)-scan
  • Material analysis
  • Manufacturing process flow
  • Supply chain examination
  • Manufacturing cost analysis


  • Apple’s first self-designed SoC for desktop computers.
  • Apple’s unprecedent innovation of 2.5D packaging with two M1 Max SoC dies connected by Local Silicon Interconnect (LSI).
  • The first TSMC InFO-L device to realize Apple UltraFusion.

Available on our Yole Group All-Inclusive Computing Package

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